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Samsung today has announced that they have developed an even faster generation of LPDDR5X memory that is set to top out at LPDDR5X-10700 speeds. The updated memory is slated to offer 25% better performance and 30% greater capacity compared to existing mobile DRAM devices from the company. The new chips also appear to be tangibly faster than Micron's LPDDR5X memory and SK hynix's LPDDR5T chips.
Samsung's forthcoming LPDDR5X devices feature a data transfer rate of 10.7 GT/s as well as maximum capacity per stack of 32 GB. This allows Samsung's clients to equip their latest smartphones or laptops with 32 GB of low-power memory using just one DRAM package, which greatly simplifies their designs. Samsung says that 32 GB of memory will be particularly beneficial for on-device AI applications.
Samsung is using its latest-generation 12nm-class DRAM process technology to make its LPDDR5X-10700 devices, which allows the company to achieve the smallest LPDDR device size in the industry, the memory maker said.
In terms of power efficiency, Samsung claims that they have integrated multiple new power-saving features into the new LPDDR5X devices. These include an optimized power variation system that adjusts energy consumption based on workload, and expanded intervals for low-power mode that extend the periods of energy saving. These innovations collectively enhance power efficiency by 25% compared to earlier versions, benefiting mobile platforms by extending battery life, the company said.
“As demand for low-power, high-performance memory increases, LPDDR DRAM is expected to expand its applications from mainly mobile to other areas that traditionally require higher performance and reliability such as PCs, accelerators, servers and automobiles,” said YongCheol Bae, Executive Vice President of Memory Product Planning of the Memory Business at Samsung Electronics. “Samsung will continue to innovate and deliver optimized products for the upcoming on-device AI era through close collaboration with customers.”
Samsung plans to initiate mass production of the 10.7 GT/s LPDDR5X DRAM in the second half of this year. This follows a series of compatibility tests with mobile application processors and device manufacturers to ensure seamless integration into future products.
Iceberg Thermal Inc. is one of the newer players in the PC cooling market. The company was founded in 2019 by an experienced team of designers and engineers setting off on their own, aiming to deliver a wide range of PC cooling products to industrial and commercial users alike. They only have a handful of retails products currently available, with the vast majority of them being CPU air coolers, but they have just launched their first liquid cooler products, the IceFLOE Oasis series.
In today’s review, we are having a look at the IceFLOE Oasis 360mm AIO (All-In-One) CPU cooler, the larger of the company's two recently-released liquid coolers. The IceFLOE Oasis CPU cooler targets the high-performance PC cooling market with a sub-$100 price point, aiming to deliver the performance needed to effectively cool a power-hungry processor without being a drain on the wallet in the process. This cooler features a 360mm radiator for an ample heat dissipation area, as well as housing for three high-airflow 120 mm fans. The IceFLOE Oasis supports a wide range of Intel and AMD socket types, making it compatible with a broad spectrum of CPUs. Additionally, it offers advanced RGB lighting, allowing users to customize the aesthetic of their cooling system.
SK hynix is one of the few vertically integrated manufacturers in the flash-based storage market. The company is well-established in the OEM market. A few years back, they also started exploring direct end-user products. Internal SSDs (starting with the Gold S31 and Gold P31) were the first out of the door. Late last year, the company introduced the Beetle X31 portable SSD, its first direct-attached storage product. In February, a complementary product was introduced - the Tube T31 Stick SSD.
The Beetle X31 is a portable SSD with a Type-C upstream port and a separate cable. The Tube T31 is a take on the traditional thumb drive with a male Type-A interface. The size of the Beetle X31 makes the use of a bridge solution obvious. Our investigation into the Tube T31 also revealed the use of the same internal SSD, albeit with a different bridge. Read on for a detailed look at the Tube T31, including an analysis of its internals and evaluation of its performance consistency, power consumption, and thermal profile.
Western Digital this week is previewing the industry's first 4 TB SD card. The device is being showcased at the NAB trade show for broadcasters and content creators and will be released commercially in 2025.
Western Digital's SanDisk Extreme Pro SDUC 4 TB SD card complies with the Secure Digital Ultra Capacity standard (SDUC, which enables up to 128TB). The card uses the Ultra High Speed-I (UHS-I) interface and is rated for speed Class 10, therefore supporting a minimum speed of 10 MB/s and a maximum data transfer rate of 104 MB/s when working in UHS104 (SDR104) mode (there is a catch about performance, but more on that later). WD's SD card is also rated to meet Video Speed Class V30, supporting a minimal sequential write speed of 30 MB/s, which is believed to be good enough for 8K video recording, above and beyond the 4K video market that Western Digital is primarily aiming the forthcoming card at.
For now, Western Digital is not disclosing what NAND is in the SanDisk Extreme Pro SDUC 4 TB SD card. Given the high capacity and relatively distant 2025 release date, WD may be targetting this as one of their first products to use their forthcoming BiCS 9 NAND.
And while not listed in WD's official press release, we would be surprised if the forthcoming card didn't also support the off-spec DDR200/DDR208 mode, which allows for higher transfer rates than the UHS-I standard normally allows via double data rate signaling. Western Digital's current-generation SanDisk Extreme Pro SDXC 1 TB SD card already supports that mode, allowing it to reach read speeds as high as 170 MB/s, so it would be surprising to see the company drop it from newer products. That said, the catch with DDR208 remains the same as always: it's a proprietary mode that requires a compatible host to make use of.
Western Digital has not disclosed how much will its SanDisk Extreme Pro SDUC 4 TB SD card cost. A 1 TB SanDisk Extreme Pro card costs $140, so one can make guesses about the price of a 4 TB SD card that uses cutting-edge NAND.
In the arena of PC components, Be quiet! is a name synonymous with excellence, known for its fusion of silent functionality and exceptional performance. The company's broad range of products, from high-end power supply units (PSUs) to sophisticated cases and cooling solutions, including both air and liquid options, is crafted with a keen eye on reducing noise while maximizing efficiency. Be quiet! has earned accolades for its dedication to achieving near-silent operation across its lineup, making it a preferred choice among those in the PC enthusiast community who seek a serene computing environment. The diversity of its offerings reflects a deep understanding of the needs of tech enthusiasts and professionals alike, with each product designed to offer a blend of low noise levels and high efficiency.
Today we're looking at he Be quiet! Straight Power 12 750W PSU, a high-tier offering in Be quiet!'s PSU portfolio that exemplifies the brand's approach to product design. The Straight Power 12 series is engineered to deliver top performance and whisper-quiet operation, appealing to users who seek the optimal mix of power efficiency and sound level, without compromising on reliability and premium quality. The 750 Watt model that we are reviewing today is the weakest unit of the series, yet still enough to effortlessly power a modern gaming system with a mid-tier GPU.
SK hynix this week announced plans to build its advanced memory packaging facility in West Lafayette, Indiana. The move can be considered as a milestone both for the memory maker and the U.S., as this is the first advanced memory packaging facility in the country and the company's first significant manufacturing operation in America. The facility will be used to build next-generation types of high-bandwidth memory (HBM) stacks when it begins operations in 2028. Also, SK hynix agreed to work on R&D projects with Purdue University.
"We are excited to become the first in the industry to build a state-of-the-art advanced packaging facility for AI products in the United States that will help strengthen supply-chain resilience and develop a local semiconductor ecosystem," said SK hynix CEO Kwak Noh-Jung.
The facility will handle assembly of HBM known good stacked dies (KGSDs), which consist of multiple memory devices stacked on a base die. Furthermore, it will be used to develop next-generations of HBM and will therefore house a packaging R&D line. However, the plant will not make DRAM dies themselves, and will likely source them from SK hynix's fabs in South Korea.
The plant will require SK hynix to invest $3.87 billion, which will make it one of the most advanced semiconductor packaging facilities in the world. Meanwhile, SK hynix held the investment agreement ceremony with representatives from Indiana State, Purdue University, and the U.S. government, which indicates parties financially involved in the project, but this week's event did not disclose whether SK hynix will receive any money from the U.S. government under the CHIPS Act or other funding initiatives.
The cost of the facility significantly exceeds that of packaging facilities built by other major players in the industry, such as ASE Group, Intel, and TSMC, which highlights how significant of an investment this is for SK hnix. In fact, $3.87 billion higher than advanced packaging CapEx budgets of Intel, TSMC and Samsung in 2023, based on estimates from Yole Intelligence.
Given that the fab comes online in 2028, based on SK hynix's product roadmap we'd expect that it will be used at least in part to assemble HBM4 and HBM4E stacks. Notably, since HBM4 and HBM4E stacks are set to feature a 2048-bit interface, their packaging process will be considerably more complex than the existing 1024-bit HBM3/HBM3E packaging and will require usage of more advanced tools, which is why it is poised to be more expensive than some existing advanced packaging facilities. Due to the extremely complex 2048-bit interface, many chip designers who are going to use HBM4/HBM4E are expected to integrate it directly onto their processors using hybrid bonding and not use silicon interposers. Unfortunately, it is unclear whether the SK hynix facility will be able to offer such service.
HBM is mainly used for AI and HPC applications, so it is strategically important to have its production in the U.S. Meanwhile, actual memory dies will still need to be made elsewhere, at dedicated DRAM fabs.
In addition to support set to be provided by state and local governmens, SK hynix chose to establish its new facility in West Lafayette, Indiana, to collaborate with Purdue University as well as with Purdue's Birck Nanotechnology Center on R&D projects, which includes advanced packaging and heterogeneous integration.
SK hynix intends to work in partnership with Purdue University and Ivy Tech Community College to create training programs and multidisciplinary degree courses aimed at nurturing a skilled workforce and establishing a consistent stream of emerging talent for its advanced memory packaging facility and R&D operations.
"SK hynix is the global pioneer and dominant market leader in memory chips for AI," Purdue University President Mung Chiang said. "This transformational investment reflects our state and university's tremendous strength in semiconductors, hardware AI, and hard tech corridor. It is also a monumental moment for completing the supply chain of digital economy in our country through chips advanced packaging. Located at Purdue Research Park, the largest facility of its kind at a U.S. university will grow and succeed through innovation."
Nowadays highest-capacity hard drives are typically aimed at cloud service providers (CSPs) and enterprises, but this does not mean that creative professionals or regular users do not need them. To cater to demands of more regular consumers, Western Digital has started shipments of its Red Pro 24 TB HDDs, which are aimed at high-end NAS use for creative professionals with significant storage requirements.
Western Digital's Red Pro 24 TB hard drives come approximately 20 months after their 22 TB model hit retail in 2022, offering an incremental improvement to WD's highest-capacity NAS and consumer hard drive offering. The platform uses conventional magnetic recording (CMR), feature a 7200 RPM rotating speed, are equipped with a 512 MB cache, and use OptiNAND technology to improve reliability as well as optimize performance and power consumption. The HDDs are rated for an up to 287 MB/s media to cache transfer rate, which makes them some of the fastest hard drives around (albeit, still a bit slower compared to CSP and enterprise-oriented HDDs).
Just like other high-end network-attached storage-aimed HDDs, the Red Pro 24 TB hard drives use helium-filled platforms that are very similar to those designed for enterprise drives. Consequently, the Red Pro 24 TB HDD are equipped with rotation vibration sensors to anticipate and proactively counteract disturbances caused by increased vibration and multi-axis shock sensors to detect subtle shock events and automatically offset them with dynamic fly height technology to ensure that heads to not scratch disks.
UPDATE 4/2/2024: Western Digital has notified us that WD Red Pro fully support ArmorCache capability, even though it is not listed in datasheets.
What these drives lack compared Apparently, just like WD Gold and Ultraster 22 TB and 24 TB drives for enterprises and cloud datacenters, WD Red Pro HDDs fully support the ArmorCache feature that provides protection against power loss when write-cache is enabled (WCE mode) and enhances performance when write-cache is disabled (WCD mode).
On the reliability side of matters, Western Digital's Red Pro 24 TB HDDs are designed for 24/7 operation in vibrating environments, such as enterprise-grade NAS with loads of bays, and are rated for up to 550 TB/year workloads as well as up to 600,000 load/unload cycles, which is in line with what Western Digital's WD Gold and Ultrastar hard drives offer.
As for power consumption, the WD Red Pro 24 TB consumes up to 6.4W during read and write operations, up to 3.9W in idle mode, and up to 1.2W in standby/sleep mode.
Western Digital's Red Pro 24 TB (WD240KFGX) HDDs are now shipping to resellers as well as NAS makers, and are slated to be available shortly. Expect these hard drives to be slightly cheaper than the WD Gold 24 TB model.
Typical CPU coolers do the job for standard heat management but often fall short when it comes to quiet operation and peak cooling effectiveness. This gap pushes enthusiasts and PC builders towards specialized aftermarket solutions designed for their unique demands. The premium aftermarket cooling niche is fiercely competitive, with brands vying to offer top-notch thermal management solutions.
Today we're shining a light on DeepCool's AK620 Digital cooler, a notable entry in the high-end CPU cooler arena. At first blush, the AK620 Digital stands out from the crowd mostly for its integrated LCD screen. Yet aesthetics aside, underneath the snappy screen is a tower cooler that was first and foremost engineered to exceed the cooling needs of the most powerful mainstream CPUs. And it's a big cooler at that: with a weight of 1.5Kg and 162mm tall, this is no lightweight heatsink and fan assembly. All of which helps to set it apart in a competitive marketplace.
Today, Intel announced that it is looking to progress its AI PC Acceleration program further by offering various new toolkits and devkits designed for software and hardware AI developers under a new AI PC Developer Program sub-initiative. Originally launched on October 23, the AI PC Acceleration program was created to connect hardware vendors with software developers, using Intel's vast resources and experience to develop a broader ecosystem as the world pivots to one driven by AI development.
Intel aims to maximize the potential of AI applications and software and broaden the whole AI-focused PC ecosystem by aiming for AI within 100 million Intel-driven AI PCs by 2025. The AI PC Developer Program aims to simplify the adoption of new AI technologies and frameworks on a larger scale. It provides access to various tools, workflows, AI-deployment frameworks, and developer kits, allowing developers to take advantage of the latest NPU found within Intel's Meteor Lake Core Ultra series of processors.
It also offers centralized resources like toolkits, documentation, and training to allow developers to fully utilize their software and hardware in tandem with the technologies associated with Meteor Lake (and beyond) to enhance AI and machine learning application performance. Such toolkits are already broadly used by developers, including Intel's open-source OpenVino.
Furthermore, this centralized resource platform is designed to streamline the AI development process, making it more efficient and effective for developers to integrate AI capabilities into their applications. It is designed to play a crucial role in Intel’s strategy to not only advance AI technology but also to make it more user-friendly and adaptable to various real-world applications.
Notably, this is both a software and a hardware play. Intel isn't just looking to court more software developers to utilize their AI resources, but they also want to get independent hardware vendors (IHVs) on board. OEMs and system assemblers are largely already covered under Microsoft's requirements for Windows certification, but Intel wants to get the individual parts vendors involved as well. How can AI be used to improve audio performance? Display performance? Storage performance? That's something that Intel wants to find out.
"We have made great strides with our AI PC Acceleration Program by working with the ecosystem. Today, with the addition of the AI PC Developer Program, we are expanding our reach to go beyond large ISVs and engage with small and medium sized players and aspiring developers" said Carla Rodriguez, Vice President and General Manager of Client Software Ecosystem Enabling. "Our goal is to drive a frictionless experience by offering a broad set of tools including the new AI-ready Developer Kit,"
The Intel AI PC Acceleration Program offers 24/7 access to resources and early reference hardware so that both ISVs and software developers can create and optimize workloads before launching retail components. Developers can join the AI PC Acceleration Program at their official webpage or email AIPCIHV@intel.com for further information
DeepCool is one of the few veterans in the PC power & cooling components field still active today. The Chinese company was first founded in 1996 and initially produced only coolers and cooling accessories, but quickly diversified into the PC Case and power supply unit (PSU) markets. To this day, DeepCool stays almost entirely focused on PC power & cooling products, with input devices and mousepads being their latest diversification attempt.
Today's review turns the spotlight toward DeepCool’s PSUs and, more specifically, the PX850G 850W ATX 3.0 PSU, which currently is their most popular power supply. The PX850G is engineered to balance all-around performance with reliability and cost, all while providing ATX 3.0 compliance. It is based on a highly popular high-output platform but, strangely, DeepCool rated the PX850G for operation up to 40°C.
SK hynix is set to unveil their first Gen5 consumer NVMe SSD lineup shortly, based on the products at display in their GTC 2024 booth. The Platinum P51 M.2 2280 NVMe SSD will take over flagship duties from the Platinum P41 that has been serving the market for more than a year.
Similar to the Gold P31 and the Platinum P41, the Platinum P51 also uses an in-house SSD controller. The key updates are the move to PCIe Gen5 and the use of SK hynix's 238L TLC NAND. Other details are scarce, and we have reached out for additional information.
| SK hynix Platinum P51 Gen5 NVMe SSD Specifications | ||||
| Capacity | 500 GB | 1 TB | 2 TB | |
| Controller | SK hynix In-House (Alistar) | |||
| NAND Flash | SK hynix 238L 3D TLC NAND at ?? MT/s ('4D' with CMOS circuitry under the NAND as per SK hynix marketing) | |||
| Form-Factor, Interface | M.2-2280, PCIe 5.0 x4, NVMe 2.0 | |||
| Sequential Read | 13500 MB/s | |||
| Sequential Write | 11500 MB/s | |||
| Random Read IOPS | TBD | |||
| Random Write IOPS | TBD | |||
| SLC Caching | Yes | |||
| TCG Opal Encryption | TBD | |||
| Warranty | TBD | |||
| Write Endurance | TBD | TBD | TBD | |
Only the peak sequential access numbers were available at the GTC booth, indicating that the drive's firmware is still undergoing tweaks. It is also unclear how these numbers are going to vary based on capacity. Availability and pricing are also not public yet.
This is a significant launch for the Gen5 consumer SSD market, where the number of available options are quite limited. The Phison E26 controller and Micron's B58R NAND combination is already in its second generation (with the NAND operating at 2400 MT/s in the newest avatar), but other vertically integrated vendors such as Samsung, Western Digital / Kioxia, and SK hynix (till now) are focusing more on the Gen4 market which has much higher adoption.
We will update the piece with additional information once the specifications are officially available.
SK Hynix said that it had started volume production of its HBM3E memory and would supply it to a customer in late March. The South Korean company is the second DRAM producer to announce mass production of HBM3E, so the market of ultra-high-performance memory will have some competition, which is good for companies that plan to use HBM3E.
According to specifications, SK Hynix's HBM3E known good stack dies (KGSDs) feature data transfer rates up to 9.2 GT/s, a 1024-bit interface, and a bandwidth of 1.18 TB/s, which is massively higher than the 6.4 GT/s and 819 GB/s offered by HBM3. The company does not say whether it mass produces 8Hi 24GB HBM3E memory modules or 12Hi 36GB HBM3E devices, but it will likely begin its HBM3E ramp from lower-capacity products as they are easier to make.
We already know that SK Hynix's HBM3E stacks employ the company's advanced Mass Reflow Molded Underfill (MR-RUF) technology, which promises to reduce heat dissipation by 10%. This technology involves the use of an enhanced underfill between DRAM layers, which not only improves heat dissipation but also reduces the thickness of HBM stacks. As a result, 12-Hi HBM stacks can be constructed that are the same height as 8-Hi modules. However, this does not necessarily imply that the stacks currently in mass production are 12-Hi HBM3E stacks.
Although the memory maker does not officially confirm this, SK Hynix's 24GB HBM3E stacks will arrive just in time to address NVIDIA's Blackwell accelerator family for artificial intelligence and high-performance computing applications.
"With the success story of the HBM business and the strong partnership with customers that it has built for years, SK Hynix will cement its position as the total AI memory provider," said Sungsoo Ryu, Head of HBM business at SK Hynix. As a result, NVIDIA will have access to HBM3E memory from multiple suppliers with both Micron and SK Hynix.
Meanwhile, AMD recently confirmed that it was looking forward to expanding its Instinct MI300-series lineup for AI and HPC applications with higher-performance memory configurations, so SK Hynix's HBM3E memory could also be used for this.
StarTech.com has introduced its latest Thunderbolt 4/USB4 docking station, which has a plethora of ports and supports four display outputs. This makes it suitable for 4Kp60 quad-monitor setups often used for professional applications. The Thunderbolt 4 Quad Display Docking Station can also deliver up to 98W of power to the host, which is enough to feed a high-end laptop, such as Apple's MacBook Pro 16.
StarTech's 15-in-1 docking (132N-TB4USB4DOCK) has pretty much everything that one comes to expect from a dock engineered explicitly for demanding professionals, such as those involved in photography, content creation, video production, and computer-aided design. The unit comes with one Thunderbolt 4/USB 4 port with a 98W power delivery capability to connect to the host, a 2.5 GbE adapter, six USB Type-A ports (three supporting 10 Gbps, two supporting 5 Gbps, and one being USB 2.0 for up to 7.5W charging), one USB Type-C connector (at 10 Gbps), four display outputs (two DP 1.4, two HDMI 2.1), an SD Card reader with UHS-II, a microSD card reader with UHS-II, and a 3.5-mm audio jack.
The dock's main selling feature is, its support for up to four displays. Of course, this is a valuable capability, but it has a couple of catches. The device can support four 4Kp60 displays when connected to a laptop featuring Intel's 12th or 14th Generation Core processor using a Thunderbolt 4 or USB 4 connector and with DSC enabled. With AMD Ryzen 6000 and Intel's 11th Gen Core-based systems, only three 4Kp60 displays are supported. Meanwhile, with MacBooks, users must get on with two 5Kp60 or one 6Kp60 display. The good news is that the Thunderbolt 4 Quad Display Docking Station requires no drivers and works seamlessly with MacOS, Windows, and ChromeOS.
The docking station has a 180W power supply, so it can simultaneously charge a laptop and power on all the remaining ports.
Thunderbolt 4 and USB 4 docks with rich capabilities are not cheap as they have to pack loads of quite expensive controllers, and StarTech's 15-in-1 docking station is no exception, as it costs $330.99.
The StarTech.com Thunderbolt 4 Quad Display Docking Station is available for purchase directly from the company and through various IT resellers and distributors such as CDW, Amazon, Ingram Micro, TD SYNNEX, and D&H.
BIOSTAR has launched its AM5-based A620MS motherboard today, bringing a new low-end option for PC users on a budget. Though BIOSTAR has not disclosed what MSRP it the A620MS motherboard will carry, the specifications of the board make it clear that it targets the lowest-end segment of the market, though it makes use of the regular A620 chipset instead of the even less expensive A620A chipset.
The A620MS sports some features typical for mATX A620 boards (which make up the vast majority of current models): two DDR5 DIMM slots that support up to two 48GB sticks, an M.2 PCIe 4.0 slot for SSDs, four SATA III ports, and a PCIe Gen4 x16 slot. The motherboard also has four debug LEDs for diagnosing CPU, RAM, GPU, and booting errors.
Meanwhile the rear I/O features a one gigabit Ethernet port, four USB 3.2 ports, analog audio jacks, two USB 2.0 ports, an HDMI 1.4 port, and DisplayPort 1.2. Though there are some more fully-featured A620 motherboards available with more ports operating at a higher specification, but the rear I/O is more or less par for the course when it comes to A620.
However, there are other things about BIOSTAR’s A620MS that implies it will be quite low-end for an A620 motherboard. It has just eight total voltage regulator modules (VRMs), which appear to be in a 6+2 or 6+1+1 phase configuration. This isn’t as low-end as BIOSTAR could have gone (ASRock offers a 4+1+1 stage board), but it is still very sparing in VRM stages compared to most other A620 motherboards. These VRMs are also not covered by a heatsink, which is also typical for boards in this segment, as they're normally paired with equally chip 65W(ish) chips.
BIOSTAR doesn’t list any official CPU restrictions in either its press release or its specification sheet; instead, the company simply lists the motherboard as compatible with Ryzen 7000 and future Ryzen 8000 processors.
While the market for AM5 motherboards includes plenty of B650(E) and X670(E) models, there’s only a handful of A620 boards in total. On Newegg, there are 14 different motherboards available, and many only differ slightly in respect to things like form factor. The cheapest of these cost $75 to $100, and while BIOSTAR didn’t reveal what price we should expect of its A620MS board, given its specifications, we expect it will land in that same $75 to $100 region.
The DNA Data Storage Alliance introduced its inaugural specifications for DNA-based data storage this week. This specification outlines a method for encoding essential information within a DNA data archive, crucial for developing and commercializing an interoperable storage ecosystem.
DNA data storage uses short strings of deoxyribonucleic acid (DNA) called oligonucleotides (oligos) mixed together without a specific physical ordering scheme. This storage media lacks a dedicated controller and an organizational means to understand the proximity of one media subcomponent to another. DNA storage differs significantly from traditional media like tape, HDD, and SSD, which have fixed structures and controllers that can read and write data from the structured media. DNA's lack of physical structure requires a unique approach to initiate data retrieval, which brings its peculiarities regarding standardization.
To address this, the SNIA DNA Archive Rosetta Stone (DARS) working group, part of the DNA Data Storage Alliance, has developed two specifications, Sector Zero and Sector One, to facilitate the process of starting a DNA archive.
Sector Zero serves as the starting point, providing minimal details necessary for the archive reader to identify the entity responsible for synthesizing the DNA (e.g., Dell, Microsoft, Twist Bioscience) and the CODEC used for encoding Sector One (e.g., Super Codec, Hyper Codec, Jimbob's Codec). Sector Zero consists of 70 bases: the first 35 bases identify the vendor, and the second 35 bases identify the codec. The information in Sector Zero enables access and decoding of data stored in Sector One. The amount of data stored in SZ is small and fits into a single oligonucleotide.
Sector One expands on this by including a description of the contents, a file table, and parameters required for transferring data to a sequencer. This specification ensures that the main body of the archive is accessible and readable, paving the way for data retrieval. Sector One contains exactly 150 bases and will span multiple oligonucleotides.
"A key goal of the DNA Data Storage Alliance is to set and publish specifications and standards that allow an interoperable DNA data storage ecosystem to grow," said Dave Landsman, of the DNA Data Storage Alliance Board of Directors. "With the publishing of the Alliance's first specifications, we take an important step in achieving that goal. Sector Zero and Sector One are now publicly available, allowing companies working in the space to adopt and implement."
The DNA Data Storage Alliance is led by Catalog Technologies, Inc., Quantum Corporation, Twist Bioscience Corporation, and Western Digital (though we are unsure whether Western Digital's NAND or HDD division is responsible for developing the specification). Meanwhile, numerous industry giants, including Microsoft, support the DNA Data Storage Alliance.
Source: SNIA
Asus on Thursday said it has released new versions of UEFI BIOS for DDR5-supporting Intel 600/700-series motherboards that enable support for 64 GB DIMMs. As a result, Asus's latest platforms for Intel's 12th, 13th and 14th Generation Core processors with four slots for DIMM slots can now work with up to 256 GB of DDR5 memory, and motherboards with two DIMM slots can now support up to 128 GB of memory.
To gain support for 256 GB of DDR5 memory using 64 GB unbuffered DIMMs, one needs to download the latest version of UEFI BIOS for one of the Intel 600/700-series motherboards listed at the Asus website.
The list of Asus motherboards with an LGA1700 socket supporting 256 GB of DDR5 memory includes 75 boards based on a variety of Intel's 600 and 700-series chipsets, including Intel Z790, H770, B760, Z690, W680, and Q670. Though taking stock of Asus's larger motherboard offerings, this is still a bit shy of covering all of Asus's LGA1700 motherboards, which is nearly 200 models in total. So 64 GB DIMM support has only come to a fraction of their boards, at least thus far.
Otherwise, it is noteworthy that cutting-edge high-capacity DIMMs, such as 32 GB, 48GB, and 64 GB, are typically not available with the same blistering XMP clockspeeds as some of their lower-capacity counterparts, so equipping an Intel system with 256 GB of memory will come at a cost of peak memory bandwidth, on top of the typical DDR5 2 DIMM Per Channel (2DPC) frequency penalty. In fact, the fastest 48 GB modules currently offered by Corsair and G.Skill (which could be used to build systems with 192 GB of memory) top out at 6600 MT/s and 6800 MT/s, respectively. Meanwhile, for now, there are no Intel XMP 3.0-compatible 64 GB DDR5 modules from these two renowned makers.
Ultimately, the prime market for high-capacity UDIMMs at this time is going to be content creators, data scientists, and other workstation-light workloads that need a quarter-terabyte of RAM, and can justify the cost for the leading-edge DIMMs. Otherwise 16 GB and 32 GB DIMMs are likely to remain the sweet spot for the LGA1700 platform for the rest of its lifecycle.
Finally, it should be noted that Asus is also announcing (or rather, reiterating) support for 64 GB DIMMs on their AM5 motherboards. That said, this support is already baked into that platform and BIOSes, and unlike the Intel boards, a BIOS update is not needed.
Corsair has launched its latest Hydro X series iCUE LINK XH405i RGB custom open-loop water cooling kits, replacing the older XH305i kits from 2020. The new kits feature Corsair’s latest XD5 RGB ELITE pump and reservoir, the XC7 RGB ELITE CPU waterblock, three QX120 RGB fans, and a 360mm radiator. The pump, waterblock, and fans all have the namesake iCUE LINK integration, which Corsair has been pushing throughout its entire recent generation of products.
The biggest hardware-related difference between XH405i kits and previous generation XH305i kits is undoubtedly the inclusion of iCUE LINK hardware, which Corsair recently debuted with its iCUE LINK H150i RGB AIO cooler. iCUE LINK allows individual Corsair cooling components within a system to be directly connected, primarily cutting down on cable clutter, but also offering the promise of more and finer-grained control over individual components via the iCUE LINK Hub at the center of a system. For instance, each individual iCUE LINK-compatible fan connected to the iCUE LINK hub can be set to its own speed, rather than either requiring each fan to be connected to its own fan header on the motherboard or setting a common speed for all fans via a multi-headed cable.
The XH405i is offered in two themes: stealth gray and white. Outside of cosmetics, the two variants are the same and come with a combined pump and reservoir, a CPU waterblock compatible with the AM5 and LGA 1700 sockets, three 120mm fans, a 360mm radiator, and a central iCUE LINK Hub. The kits also come with all the accessory components needed to build a custom loop: hardline tubing, a bending kit, fittings, and XL8 clear-colored coolant. These kinds of kits are usually geared towards newcomers to custom liquid cooling and users who need a brand-new loop but don’t want to spend much time scouring for individual components.
Separately, Corsair has also launched the iCUE LINK XG7 RGB GPU waterblock for GeForce RTX 4090 and 4080 Super graphics cards. As is typically the case for full-coverage GPU waterblocks, the XG7 has specific hardware compatibility requirements, and as a result Corsair is making four versions of the waterblock. The company is targetting ASUS’s ROG STRIX and TUF cards, as well as MSI’s SUPRIM and GAMING TRIO lineups, offering RTX 4090 and RTX 4080 blocks for each of those card families. Just like the other components in the XH405i kit, the GPU waterblock is also iCUE LINK-equipped.
Aimed at a premium market, the full XH405i kit doesn't come cheap: Corsair has set the MSRP at $700 for the complete cooling collection. Meanwhile, the XG7 GPU waterblock is priced at $230 for all four models.
The iCUE LINK XH405i kit is available now at Newegg and Amazon, as well as through Corsair’s own website.
ARCTIC GmbH, originally known as Arctic Cooling, first burst onto the PC cooling scene in 2001 and has since maintained its stature as a leader in cooling technologies. The company made its mark with top-notch thermal compounds and has since kept its focus on cooling solutions while also expanding into other tech accessories, including advanced monitor mounts and audio products.
With the introduction of the Liquid Freezer III series, ARCTIC has taken another significant step forward in the cooling market. This new lineup builds upon the success of the previous Liquid Freezer II series, the great price-to-performance ratio of which made it a highly popular product. Today, we're delving into ARCTIC's latest offerings with the Liquid Freezer III series and, specifically, the 280 A-RGB White model. We'll assess the features, quality, and thermal performance of the AIO (All-In-One) cooler of the series ARCTIC is hoping to dominate the bulk of the mainstream market with.
Be quiet! is renowned for its dedication to excellence in the realm of PC components, specializing in products that emphasize silence and performance. The brand's product lineup is extensive, encompassing high-quality power supply units (PSUs), cases, and cooling solutions, including air and liquid coolers. Be quiet! is particularly renowned for trying to achieve whisper-quiet operation across all its products, making it a favorite among PC enthusiasts who prioritize a noiseless computing environment. The brand's portfolio reflects a dedication to meeting the diverse needs of tech aficionados and professionals, with an array of products that emphasize noise reduction and efficiency.
This review shines a spotlight on the Be quiet! Pure Power 12 M 650W PSU, a standout product in Be quiet!'s PSU collection that illustrates the company's attitude towards product design. The Pure Power 12 M series is designed to provide dependable performance and quiet operation, catering to users who demand a good balance of power efficiency and acoustics with reliability and value. This model, in particular, strives to offer a compelling blend of performance and quality, making it an attractive option for individuals seeking a PSU that aligns with the requirements of both entry-level and advanced PC builds.
Today NVIDIA has brought variable refresh rate support to its GeForce Now cloud gaming service. The company initially promised variable refresh support on GeForce Now back in early January during CES, and has seemingly waited so that it could launch alongside GeForce Now Day Passes, which are also now available.
Variable refresh rate (VRR) technologies, including NVIDIA's own G-Sync, have been around for around a decade now, and allow a monitor to synchronize its refresh rate to the instantaneous framerate of a game. This synchronization prevents screen tearing, when two or more frames are present on a display at the same time. Without a VRR technology, gamers either have to tolerate the visual incongruity of screen tearing or enable V-Sync, which solves screen tearing by locking the framerate to the refresh rate (or a fraction thereof). VRR became popular because V-Sync added latency and could depress framerates due to it effectively being a framerate limiter.
Dubbed "Cloud G-Sync", NVIDIA touts not only a screen tearing-free experience for GeForce Now thanks to variable refresh rate support, but also lower latency thanks to “varying the stream rate to the client, driving down total latency on Reflex-enabled games.” Prior to VRR’s debut on GeForce Now, users either had to enable V-Sync in-game, enable a stream-level V-Sync setting that had the benefit of not locking the game framerate, or accept screen tearing. GeForce Now Ultimate members will also be able to pair VRR with Reflex-powered 60 FPS and 120 FPS streaming modes.
According to NVIDIA’s technical documentation, variable refresh rate support on GeForce Now can work with both Mac and Windows PCs hooked up to a VRR-capable monitor. This includes G-Sync monitors on Windows, as well as VESA AdaptiveSync/FreeSync monitors, HDMI 2.1 VRR displays, and even Apple ProMotion displays, such as the panels built into their recent MacBook Pro laptops. The biggest compatibility hurdle at this time is actually on the GPU side of matters; Windows machines need an NVIDIA GPU to use VRR with GeForce Now. Intel and AMD GPUs are "not supported at this time."
Although G-SYNC originally came out in 2013 and GeForce Now has been available since 2015, the two never intersected until now. It’s not clear why NVIDIA waited so long to bring G-Sync to GeForce Now; the company’s original announcement merely states “newly improved cloud G-SYNC technology goes even further,” implying that it wasn’t possible before but doesn’t exactly explain why.
Western Digital had unveiled the SanDisk Professional PRO-BLADE modular SSD ecosystem in mid-2022 to serve the needs of the professional market. Compact and sturdy NVMe drives (PRO-BLADE SSD Mag) swappable across discrete bus-powered enclosures (PRO-BLADE TRANSPORT), and also compatible with a multi-bay reader (PRO-BLADE STATION) have perfectly fit the requirements of multi-user / multi-site workflows in the content capture industry. Read on for a detailed look at the first-generation PRO-BLADE SSD Mags and the PRO-BLADE TRANSPORT enclosure. In addition to the evaluation of the performance consistency, power consumption, and thermal profile, an analysis of the internals is also included.
Now well in the midst of executing its plan to divide itself into separate hard drive and NAND businesses, Western Digital today offered a fresh update on the state of that split, and what the next steps are for the company. With the eventual goal of dividing the company into two independent, publicly traded companies, Western Digital is reporting that they have made significant progress in key transactional projects, and they are also announcing their initial leadership appointments for the post-separation businesses.
Western Digital's separation, announced on October 30, 2023, aims to create two focused companies with distinct product lineups for hard drives and NAND flash memory, respectively, as well as NAND flash memory-based products. This move is expected to speed up innovation and introduce new growth opportunities, according to Western Digital. Meanwhile, with separate capital structures, operational efficiency of the two entities will be higher compared to the united company, the management of Western Digital claims.
Western Digital led the storage industry's consolidation by acquiring HGST, various SSD and flash companies in the early 2010s, and SanDisk in 2016 for NAND flash production. As a result, in late 2010s the company become a media-agnostic, vertically-integrated storage technology company. However, the company faced challenges in growing its revenue. The 3D NAND and SSD markets are highly competitive commodity markets, and as a result they tend to fluctate depending on supply and demand. Meanwhile, demand for HDDs is declining and offseting decreasing unit sales with 3D NAND-based products and nearline hard drives was challenging. Meanwhile, to avoid avoid competition with larger storage solutions providers like Dell, HPE, and IBM — which purchase Western Digital's HDDs, SSDs, and NAND memory — Western Digital had to divest its storage solutions, which presents additional challenges.
As a result, Western Digital's HDD and NAND businesses have acted largely independently since late 2020, when it became apparent that the combined company has failed to become bigger than the sum of Western Digital and SanDisk parts. So far, quite some progress has been made in preparing for the separation, including establishing legal entities in 18 countries, preparing independent financial models, and finalizing preparations for regulatory filings. As a result, the company remains on track to finish the split in the second-half of this year, according to Western Digital.
With regards to post-split leadership, David Goeckeler has been appointed as the chief executive designate for the NAND flash memory spinoff company. He expressed enthusiasm for the NAND business's potential in market growth and the development of new memory technologies.
"Today's announcement highlights the important steps we are making towards the completion of an extremely complex transaction that incorporates over a dozen countries and spans data storage technology brands for consumers to professional content creators to the world’s leading device OEMs and the largest cloud providers," said David Goeckeler, CEO of Western Digital. "I am pleased with the exceptional work the separation teams have done so far in creating a spin-ready foundation that will ensure a successful transition to independent, market-leading companies for our Flash and HDD businesses."
Meanwhile, Irving Tan, currently executive vice president of global operations, will assume the CEO role for the standalone HDD company, which will continue to operate under the Western Digital brand. It is unclear where Ashley Gorakhpurwalla, currently the head of WDC's HDD business unit, will end up, or if he'll even remain with the company at all.
"While both Western Digital's businesses will have the strategic focus and resources to pursue exciting opportunities in their respective markets once the separation is complete, the Flash business offers exciting possibilities with market growth potential and the emerging development of disruptive, new memory technologies," added Goeckeler. "I am definitely looking forward to what's next for the spinoff team."
Silicon Power announced the MS70 and PX10 Portable SSDs in late 2023. The company is well known for offering entry- and mid-range products at compelling price points, but the two products came with plenty of promises in the 1GBps-class category. The MS70 promised high storage density (up to 2TB in a compact thumb drive), while the PX10 targeted power users and professionals with performance consistency as the focus. Read on for a detailed look at the Silicon Power PX10 including an analysis of its internals, value proposition, and evaluation of its performance consistency, power consumption, and thermal profile.
Cooler Master, renowned for its pioneering role in cooling technologies, has evolved into a key player in the PC components industry, extending its expertise to include cases and power supply units (PSUs). The company's current catalog is a testament to its commitment to diversity, featuring over 75 PC cases, 90 coolers, and 120 PSUs, all designed to cater to the evolving demands of tech enthusiasts and professionals alike.
This review focuses on the Cooler Master MWE Gold V2 750W PSU, a key offering in Cooler Master's power supply lineup that embodies the brand's vision of combining quality and value. The MWE Gold V2 series is engineered to offer solid performance and reliability at a price point that appeals to system builders and gamers looking for an entry-level to mid-range solution. As a result, the MWE Gold V2 750W has been a consistently popular offering within Cooler Master's catalog, often cycling in and out of stock depending on what sales are going on. This makes the PSU a bit harder to track down in North America than it does Europe, and quick to vanish when it does show up.
Crucial is unveiling the latest addition to its Gen5 consumer NVMe SSD lineup today - the T705 PCIe 5.0 M.2 2280 NVMe SSD. It takes over flagship duties from the Crucial T700 released last year. The company has been putting focus on the high-end consumer SSD segment in the last few quarters. The T700 was one of the first to offer more than 12 GBps read speeds, and the T705 being launched today is one of the first drives available for purchase in the 14+ GBps read speeds category.
The Crucial T705 utilizes the same platform as the T700 from last year - Phison's E26 controller with Micron's B58R 232L 3D TLC NAND. The key difference is the B58R NAND operating at 2400 MT/s in the new T705 (compared to the 2000 MT/s in the T700). Micron's 232L NAND process has now matured enough for the company to put out 2400 MT/s versions with enough margins. Similar to the T700, this drive is targeted towards gamers, content creators, and professional users as well as data-heavy AI use-cases.
The move to 2400 MT/s NAND has allowed Crucial to claim an increase in the performance of the drive in all four corners - up to 20% faster random writes, and 18% higher sequential reads. Additionally, Crucial also claims more bandwidth in a similar power window for the new drive.
The T705 is launching in three capacities - 1TB, 2TB, and 4TB. Both heatsink and non-heatsink versions are available. Crucial is also offering a white heatsink limited edition for the 2TB version. This caters to users with white-themed motherboards that are increasingly gaining market presence.
Phison has been pushing DirectStorage optimizations in its high-end controllers, and it is no surprise that the T705 advertises the use of Phison's 'I/O+ Technology' to appeal to gamers. Given its high-performance nature, it is no surprise that the E26 controller needs to be equipped with DRAM for managing the flash translation layer (FTL). Crucial is using Micron LPDDR4 DRAM (1GB / TB of flash) in the T705 for this purpose.
| Crucial T705 Gen5 NVMe SSD Specifications | ||||
| Capacity | 1 TB | 2 TB | 4 TB | |
| Model Numbers | CT1000T705SSD3 (Non-Heatsink) CT1000T705SSD5 (Heatsink) |
CT2000T705SSD3 (Non-Heatsink) CT2000T705SSD5 (Black Heatsink) CT2000T705SSD5A (White Heatsink) |
CT4000T705SSD3 (Non-Heatsink) CT4000T705SSD5 (Heatsink) |
|
| Controller | Phison PS5026-E26 | |||
| NAND Flash | Micron B58R 232L 3D TLC NAND at 2400 MT/s | |||
| Form-Factor, Interface | Double-Sided M.2-2280, PCIe 5.0 x4, NVMe 2.0 | |||
| Sequential Read | 13600 MB/s | 14500 MB/s | 14100 MB/s | |
| Sequential Write | 10200 MB/s | 12700 MB/s | 12600 MB/s | |
| Random Read IOPS | 1.4 M | 1.55 M | 1.5 M | |
| Random Write IOPS | 1.75 M | 1.8 M | 1.8 M | |
| SLC Caching | Dynamic (up to 11% of user capacity) | |||
| TCG Opal Encryption | Yes | |||
| Warranty | 5 years | |||
| Write Endurance | 600 TBW 0.33 DWPD |
1200 TBW 0.33 DWPD |
2400 TBW 0.33 DWPD |
|
| MSRP | $240 (24¢/GB) (Non- Heatsink) $260 (26¢/GB) (Heatsink) |
$400 (20¢/GB) (Non- Heatsink) $440 (22¢/GB) (Black Heatsink) $484 (24.2¢/GB) (White Heatsink) |
$714 (17.85¢/GB) (Non- Heatsink) $730 (18.25¢/GB) (Heatsink) |
|
Crucial is confident that the supplied passive heatsink is enough to keep the T705 from heavy throttling under extended use. The firmware throttling kicks in at 81C and protective shutdown at 90C. Flash pricing is not quite as low as it was last year, and the 2400 MT/s flash allows Micron / Crucial to place a premium on the product. At the 4TB capacity point, the drive can be purchased for as low as 18¢/GB, but the traditional 1TB and 2TB ones go for 20 - 26 ¢/GB depending on the heatsink option.
There are a number of Gen5 consumer SSDs slated to appear in the market over the next few months using the same 2400 MT/s B58R 3D TLC NAND and Phison's E26 controller (Sabrent's Rocket 5 is one such drive). The Crucial / Micron vertical integration on the NAND front may offer some advantage for the T705 when it comes to the pricing aspect against such SSDs. That said, the Gen5 consumer SSD market is still in its infancy with only one mass market (Phison E26) controller in the picture. The rise in consumer demand for these high-performance SSDs may coincide with other vendors such as Innogrit (with their IG5666) and Silicon Motion (with their SM2508) gaining traction. Currently, Crucial / Micron (with their Phison partnership) is the only Tier-1 vendor with a high-performance consumer Gen5 SSD portfolio, and the T705 cements their leadership position in the category further.
Alphacool, a renowned name in the realm of PC cooling solutions, recently launched their Apex Stealth Metal series of cooling fans. Prior to their launch, the new fans had amassed a significant amount of hype in the PC community, in part because of the unfortunate misconception that the entire fan would be made out of metal.
Regardless of whether they're made entirely out of metal or not, however, these fans are notable for their unique construction, combining a metallic frame with plastic parts that are decoupled from the metal. This design choice not only contributes to the fan's aesthetic appeal but also plays a role in its operational efficiency.
The series includes two distinct models, the Apex Stealth Metal 120 mm and the Apex Stealth Metal Power 120 mm, distinguished primarily by their maximum rotational speeds. The former reaches up to 2000 RPM, while the latter, designed for more demanding applications, can achieve a remarkable 3000 RPM. Available in four color options – White, Matte Black, Chrome, and Gold – these fans offer a blend of style and functionality, making them a versatile choice for various PC builds.
For established PC peripheral vendors, the biggest challenge in participating in the highly commoditized market is setting themselves apart from their numerous competitors. As designs for coolers and other peripherals have converged over the years into a handful of basic, highly-optimized designs, developing novel hardware for what is essentially a "solved" physics problem becomes harder and harder. So often then, we see vendors focus on adding non-core features to their hardware, such as RGB lighting and other aesthetics. But every now and then, we see a vendor go a little farther off of the beaten path with the physical design of their coolers.
Underscoring this point – and the subject of today's review – is Enermax's latest all-in-one (AIO) CPU cooler, the LiqMaxFlo 360mm. Designed to compete in the top-tier segment of the cooling market, Enermax has opted to play with the physics of their 360mm cooler a bit by making it 38mm thick, about 40% thicker than the industry average of 27mm. And while Enermax is hardly the first vendor to release a thick AIO cooler, they are in much more limited company here due to the design and compatibility trade-offs that come with using a thicker cooler – trade-offs that most other vendors opt to avoid.
The net result is that the LiqMaxFlo 360mm gets to immediately start off as differentiated from so many of the other 360mm coolers on the market, employing a design that can give Enermax an edge in cooling performance, at least so long as the cooler fits in a system. Otherwise, not resting on just building a bigger cooler, Enermax has also equipped the LiqMaxFlo 360mm with customizable RGB lighting, allowing it to also cater to the aesthetic preferences of modern advanced PC builders. All together, there's a little something for everyone with the LiqMaxFlo 360mm – and a lot of radiator to cram into a case. So let's get started.
A recall on 12VHPWR angled adapters from CableMod has reached its next stage this week, with the publication of a warning document from the U.S. Consumer Product Safety Commission. Referencing the original recall for CableMods' V1.0 and V1.1 adapters, which kicked off back in December, the CPSC notice marks the first involvement of government regulators. And with that has come to light a bit more detail on just how big the recall is overall, along with an estimated failure rate for the adapters of a hair over 1%.
According to the CPSC notice, CableMod is recalling 25,300 adapters, which were sold between February, 2023, and December, 2023. Of those, at least 272 adapters failed, as per reports and repair claims made to CableMod. That puts the failure rate for the angled adapters at 1.07% – if not a bit higher due to the underreporting that can happen with self-reported statistics. All told, the manufacturer has received at least $74,500 in property damage claims in the United States, accounting for the failed adapters themselves, as well as the video card and anything else damaged in the process.
As part of the recall, CableMod has asked owners of its angled 12VHPWR adapters V1.0 and V1.1 to stop using them immediately, and to destroy them to prevent future use. Buyers can opt for a full refund of $40, or a $60 store credit.
It is noteworthy that, despite the teething issues with the initial design of the 12VHPWR connector – culminating with the PCI-SIG replacing it with the upgraded 12V-2x6 standard – the issue with the CableMod adapters is seemingly distinct from those larger design flaws. Specifically, CableMod's recall cites issues with the male portion of their adapters, which was not altered in the 12V-2x6 update. Compared to 12VHPWR, 12V-2x6 only alters female plugs (such as those found on video cards themselves), calling for shorter sensing pins and longer conductor terminals. Male plugs, on the other hand, remain unchanged, which is why existing PSU cables made for the 12VHPWR remain compatible (and normally safe) with 12V-2x6 video cards. Though as cable mating is a two-way dance, it's unlikely having to plug into inadequate 12VHPWR female connectors did CableMod any favors here.
Sources: Consumer Product Safety Commission, HotHardware, CableMod
Today we're looking at a all-in-one closed loop cooler from a face that's new to AnandTech: Geometric Future. Founded in 2020, Geometric Future is a PC components manufacturer with a goal of setting themselves apart in the crowded PC marketplace by redefining modern aesthetics. Their approach to design emphasizes the application of geometric elements and minimalist philosophy, as reflected in their slogan, "Simplify". They regard themselves as a potential future backbone in China's design industry, starting with a small step in the IT sector.
For such a new company, Geometric Future has already made significant strides in the realm of PC power and cooling products. One of their most notable products – and what we're reviewing today – is the Eskimo Junior 36, an all-in-one CPU liquid cooler available in 240mm and 360mm sizes. This cooler is designed with a minimalist aesthetic in mind, featuring a simplistic CPU block and equipped with high-performance Squama 2503 fans. Geometric Future pitches the Eskimo Junior 36 as being engineered to provide an optimal balance of cooling efficiency and aesthetics, making it able to achieve excellent cooling capabilities while maintaining low noise levels.
But marketing claims aside, we shall see where it stands in today’s highly competitive market in this review.
Asus has introduced a USB4 PCIe add-in-card for the company's desktop motherboards, allowing users to add two USB4 ports to their systems. The card can be used to connect up to four devices and a display to each of its ports, and can even be used to charge laptops that support USB charging.
The Asus USB4 PCIe Gen4 Card is based on ASMedia's ASM4242 controller and supports two USB4 ports at 40 Gbps data rates, with up to 60W USB Power Delivery. The board also has two DisplayPort inputs to in order to route graphics through the card as well in order to make full use of the versatility offered by USB4 and the Type-C cable. Alternatively, one can connect the card to the motherboard TB3/TB4 header and use integrated GPU to handle displays connected using USB-C cables.
One of the main advantages that the ports of Asus USB4 PCIe Gen4 card have over USB4 ports found on some motherboards is that it supports 60W Quick Charge 4+ to devices, which enables to charge laptops or connect devices that demand more than 15W of power (but less than 60W).
There is a catch about the Asus USB4 PCIe Gen4 card though: it is only compatible with Asus motherboards and needs a motherboard with a Thunderbolt or USB4 header (which is mostly designed to use integrated GPU). The company says that many of its AM5 and Intel 700-based motherboards have an appropriate header, so the device can be used on most of its current-generation boards.
The card operates on a PCIe 4.0 x4 interface, providing 7.877 GB/s of bandwidth to the ASMedia controller. The card also features a six-pin auxiliary PCIe connector to supply the additional power needed for the card's high-powered ports.
Asus has yet to reveal recommended price and availability date of its USB4 expansion card. Given that this is not the industry's first card of this kind, expect it to be competitively priced in comparison to existing Thunderbolt 3/4 expansion cards, which have been on the market for a while.
With recent high-performance CPUs exhibiting increasingly demanding cooling requirements, we've seen a surge in releases of new dual-tower air cooler designs. Though not new by any means, dual-tower designs have taken on increased importance as air cooler designers work to keep up with the significant thermal loads generated by the latest processors. And even in systems that aren't running the very highest-end or hottest CPUs, designers have been looking for ways to improve on air cooling efficiency, if only to hold the line on noise levels while the average TDP of enthusiast-class processors continues to eke up. All of which has been giving dual-tower coolers a bigger presence within the market.
At this point many major air cooler vendors are offering at least one dual-tower cooler, and, underscoring this broader shift in air cooler design, they're being joined by the liquid-cooling focused Corsair. Best known within the PC cooling space for their expansive lineup of all-in-one (AIO) liquid PC CPU coolers, Corsair has enjoyed a massive amount of success with their AIO coolers. But perhaps as a result of this, the company has exhibited a notable reticence towards venturing into the air cooler segment, and it's been years since the company last introduced a new CPU air cooler. This absence is finally coming to an end, however, with the launch of a new dual-tower air cooler.
Our review today centers on Corsair's latest offering in the high-end CPU air cooler market, the A115. Designed to challenge established models like the Noctua NH-D15, the A115 is Cosair's effort to jump in to the high-end air cooling market with both feet and a lot of bravado. The A115 boasts substantial dimensions to maximize its cooling efficiency, aiming not just to meet but to surpass the cooling requirements of the most demanding mainstream CPUs. This review will thoroughly examine the A115's performance characteristics and its competitive standing in the aftermarket cooling market.
Following the latest legal defeat in Apple's ongoing patent infringement fight over blood oxygen sensors, the company is set to remove its blood oxygen measurement feature from its Watch Series 9 and Watch Ultra 2 sold in the U.S. The decision comes after the U.S. Court of Appeals for the Federal Circuit declined to extend a pause on an import ban imposed by the U.S. International Trade Commission (USITC) last year, making way for the ban to finally take effect.
The legal setback stems from a ruling that Apple's watches infringed on patents related to blood oxygen measurement that belong to Masimo, which sued Apple in 2020. The U.S. Court of Appeals' decision means that Apple must stop selling watches with this feature while the appeal, which could last a year or more, is in progress.
As the ruling bars Apple from selling additional watches with this feature, the company has been left with a handful of options to comply with the ruling. Ceasing watch sales entirely certainly works – though is unpalatable for obvious reasons – which leaves Apple with removing the feature from their watches in some manner. Any hardware retool to avoid infringing upon Masimo's patents would take upwards of several quarters, so for the immediate future, Apple will be taking the unusual step of disabling the blood oxygen sensor feature in software instead, leaving the physical hardware on-device but unused.
The new, altered Apple Watch models will be available from Thursday in Apple's retail and online stores. Despite the change, the company maintains that the USITC's decision is erroneous and continues to appeal. Apple stresses that the blood oxygen feature will still be available in models sold outside the U.S., and perhaps most critically, watches sold in the U.S. before this change will keep their blood oxygen measuring capability.
"Pending the appeal, Apple is taking steps to comply with the ruling while ensuring customers have access to Apple Watch with limited disruption," the company said in a statement published by Bloomberg.
It is noteworthy that the Patent Trial and Appeal Board invalidated 15 of 17 Masimo's patents it reviewed, a verdict that Masimo is currently challenging. In Masimo's trial for trade secret misappropriation last May, a judge ruled out half of Masimo's 10 allegations due to a lack of adequate evidence. Regarding the remaining allegations, most jurors agreed with Apple's position, but the trial ultimately ended with an 11-1, non-unanimous decision, resulting in a mistrial. Scheduling of a new trial to settle the matter is still pending. In the meantime, Apple has been left with little choice but to downgrade its products to keep selling them in the U.S.
Seagate's financial reports have been indicating imminent mass production of HAMR HDDs for a few years now, and it looks like the wait for these drives to appear in retail is finally at an end. The Seagate Exos product family is getting a 30TB capacity point, thanks to the use of heat-assisted magnetic recording (HAMR) technology. The company talked to the press last week about the Mozaic 3+ platform – their first high-volume HAMR platform – and how it sets the stage for rapid areal density scaling over the next few years.
Seagate's new Exos 30TB HDDs use platters with an areal density of 3TB per platter, and Seagate has plans to scale that up at a rate of up to 20% generation-over-generation in the next few years (compared to the 8% rate that CMR HDD capacities have been growing at in the last decade or so). The company indicated that volume shipments are happening this quarter to hyperscalers. Seagate is observing that the average customer upgrading from a 16TB conventional magnetic recording platform to the new 30TB+ HDDs can almost double the capacity of their server racks in the same footprint, as the new drives are drop-in replacements. This brings TCO benefits, particularly in terms of power consumption. The company is even quantifying that - the Exos X16's average power consumption of 9.44W translates to 0.59W / TB. The new Exos 30TB's equivalent number is a bit higher at 10.5W, but that translates to a 40% power savings on a per-TB basis at 0.35W / TB.
The company stressed upon the fact that HAMR needed a host of other breakthroughs grouped under the new Mozaic 3+ tag in order to achieve the areal density breakthrough enabling the new Exos family. These include:
Areal density gains are primarily driven by smaller grain sizes in the magnetic media. However, legacy magnetic platter media is not stable at very small grain sizes. Along with Showa-Denko, Seagate has developed a superlattice iron-platinum structure with increased magnetic coercivity to allow for precise and stable data recording. The HAMR process requires heating up of the grain in order to alter its state, and Seagate has achieved this using a nanophotonic laser that is vertically integrated into the plasmonic writer sub-system. The reading head has also needed to evolve in order to tap into the smaller grains. All of these advancements work together thanks to a newly developed controller (built on TSMC's 12nm process) that Seagate claims to deliver 3x the performance of existing solutions.
Seagate expects the Mozaic platform to lead to 5TB/platter as early as 2028.
Areal density scaling is one of the key aspects in addressing the HDD capacity issue. One aspect that this scaling has not addressed is the IOPS/TB metric, where SSDs are in a much better place to take advantage of advancements in host interface technology. The Mozaic platform is orthogonal to currently-used HDD technologies such as dual actuators and shingled-magnetic recording. Additional benefits can be gleaned from those, but the IOPS/TB metric scaling is an aspect that needs industry-wide efforts to address to keep HDDs relevant in more application areas.
Seagate works with vendors such as Showa-Denko for the platters and TDK for the recording heads. Some of the Mozaic 3+ innovations have been jointly developed with them. While the exact details of the joint development are confidential, Seagate indicated that they have a time-limited exclusive use for these technological advancements. If, and when, other HDD vendors move to HAMR, it appears that Seagate has a healthy lead to fall back on with respect to these core HAMR platform components. The company is also expecting the Mozaic 3+ technology to address use-cases as as NAS, and video / imaging markets. It is only a matter of time before HAMR moves from Exos to the IronWolf and SkyHawk families.
Last month we took a look at Be Quiet's Dark Rock Elite, the company's flagship CPU tower air cooler. The RGB LED-equipped cooler proved flashy in more ways than one, but true to its nature as a flagship product, it also carried a $115 price tag to match. Which is certainly not unearned, but it makes the Elite hard to justify when pairing it with more mainstream CPUs, especially as these chips don't throw off the same chart-topping levels of heat as their flagship counterparts.
Recognizing the limited audience for a $100+ cooler, Be Quiet! is also offering what is essentially a downmarket version of that cooler with the Dark Rock Pro 5. Utilizing the same heatsink as the Dark Rock Elite as its base, the Dark Rock Pro 5 cuts back on some of the bells and whistles that are found on the flagship Elite in order to sell at a lower price while still serving as a high-end cooler. Among these changes are getting rid of the RGB lighting, and using simple wire fan mounts in place of the Elite's nifty rails. The end result is that it allows the Dark Rock Pro 5 to hit a notably lower price point of $80, putting it within the budgets of more system builders, and making it a more practical pairing overall with mainstream CPUs.
But perhaps the most important aspect of all is a simple one: cooling performance. What does the Dark Rock Pro 5 give up in cooling performance in order to hit its lower price tag? As we'll see in this review, the answer to that is "surprisingly little," making the Dark Rock Pro 5 a very interesting choice for mid-to-high end CPUs. Particularly for system builders looking for an especially quiet CPU cooler.
The network-attached storage (NAS) market had a break-out decade in the 2010s, with a large number of vendors trying to get a slice of the pie. Brands such as EMC / Lenovo and Thecus have fallen by the wayside, and even established storage vendors like Seagate decided to drop out of the market. QNAP and Synology have held firm in the commercial off-the-shelf (COTS) NAS market meant for home users, prosumers, SOHO, and SMB installations. ASUSTOR (backed by ASUS) has also been regularly releasing NAS units since their first product appeared in late 2012. TerraMaster released their first NAS around the same time, but opted to focus more on the direct-attached storage segment throughout the 2010s. The brand has shown renewed interest in the NAS market over the last few years. Despite the cut-throat competition in the COTS NAS market, some Asian vendors are attempting to get a toe-hold after establishing themselves in allied markets. UGREEN, a consumer electronics brand known for its power banks, chargers, USB adapters, and docks has also announced its entry into the NAS market, but we will cover that in a separate article.
Asustor, Buffalo, QNAP, Synology, TerraMaster, and Western Digital are currently the main options available for users looking to purchase a COTS NAS for SOHO / SMB use. Out of these, Buffalo and WD update their hardware options only once every 3 or 4 years. The others have a more regular cadence to their portfolio additions while continuing to maintain software support for the legacy units - sometimes even NAS units released as far as 10 years ago.
CES has usually been a good platform for NAS vendors, allowing them to show their latest and greatest in both hardware and software, and occasionally announce new models. However, the allure has been lost in recent years. It started with Synology and QNAP starting their own conference aimed towards partners / resellers and developers. Eventually, CES became relatively quiet for this market segment. Other business conferences focused on virtualization, security etc. are turning out to be better events for these NAS vendors. Overall, CES is no longer an important show for the NAS market. Having said that, the rest of this piece captures some of the announcements made in the NAS space around the 2024 CES time-frame.
At the 2024 CES, UGREEN made a big splash with the hardware options for their upcoming NASync series. Synology's booth rehashed units that have been around for a major part of 2023. A chuckle-worthy DS224+ (using an ancient Intel Celeron J4125) was also on display. ASUSTOR had a tiny presence in ASUS's suite, and the other NAS vendors gave the show a miss.
ASUSTOR has updated their lineup of Arm-based NAS units for home / personal use, and the units are already available for purchase. The new Drivestor 2 Lite, 2 Pro Gen2, and 4 Pro Gen2 use a new Realtek processor - the RTD1619B. This is a quad-core Cortex-A55 SoC with the CPU running at 1.7 GHz. The Arm Mali-G51 MP3 in the SoC is clocked at 650 MHz. This lineup takes over the Drivestor 2, 4, 2 Pro, and 4 Pro units which had the Realtek RTD1296 (quad-core Cortex-A53 at 1.4 GHz). The increased processing power in the new processor, coupled with a new SDK from Realtek, has now allowed ASUSTOR to bring btrfs support in this lineup.
Despite using the same SoC, the Lite model differentiates itself from the Pro model by opting for half the RAM, and restricting itself to a 1 GbE LAN port (compared to the 2.5 GbE in the Pro ones). Two USB 3.2 Gen 1 Type-A ports in the Pro models are placed by a USB 2.0 port in the Lite model. There are two drive bays, but the drives themselves are not hot-swappable. ASUSTOR is promoting the transcoding performance of the new performance and portraying the Drivestor 2 Lite as a capable NAS for Plex and their own 'LooksGood' application.
The Pro Gen2 models have hot-swappable bays. In addition to the hardware configuration updates, ASUSTOR is promoting a different set of applications such as Portainer (Docker) compared to the Lite model. The differences in the specifications are brought out in the table below.
| ASUSTOR 2024 Drivestor Lineup | |||
| Model | Drivestor 2 Lite | Drivestor 2 Pro Gen2 | Drivestor 4 Pro Gen2 |
| ID | AS1102TL | AS3302T v2 | AS3304T v2 |
| SoC Platform | Realtek RTD1619B (4x Cortex-A55 @ 1.7 GHz / Arm Mali-G51 MP3) |
||
| RAM | 1 GB DDR4 (Soldered) | 2 GB DDR4 (Soldered) | |
| OS Storage | 8GB eMMC | ||
| Internal Storage / Bays | 2x 3.5" SATA | 4x 3.5" SATA | |
| I/O Ports | 1x USB 3.2 Gen 1 1x USB 2.0 |
3x USB 3.2 Gen 1 | |
| Network Ports | 1x RJ-45 (1 GbE) | 1x RJ-45 (2.5 GbE) | |
| Power Adapter | 65W (External) | 90W (External) | |
| Dimensions and Weight | 165mm x 102mm x 218mm / 1.14 kg | 170mm x 114mm x 230mm / 1.6 kg | 170mm x 174mm x 230mm / 2.2 kg |
| Price | $175 | $269 | $339 |
ASUSTOR has moved to the same platform adopted by Synology for the DS223 and other 23-series personal / home NAS models, keeping pace with the processing power offered by the competition. The introduction of btrfs support in this lineup now brings easy snapshots (and a bit of ransomware protection) to ASUSTOR's customers at an affordable price point.
TerraMaster recently updated their entry-level x86 NAS lineup for SOHO / SMB setups. This segment was served last year by the 423 series based on Jasper Lake (Celeron N5095). The 424 series utilizes Alder Lake-N. With Intel promoting an octa-core configuration as a Core i3 in this series, TerraMaster is also launching a 424 Pro utilizing the Core i3-N300.
The specifications of the three units are summarized in the table below.
| TerraMaster 424 NAS Series (Alder Lake-N) | |||
| Model | F2-424 | F4-424 | F4-424 Pro |
| SoC Platform | Intel N95 (4x Gracemont @ up to 3.4 GHz / Intel UHD Graphics) |
Intel Core i3-N300 (8x Gracemont @ up to 3.8 GHz / Intel UHD Graphics) |
|
| RAM | 1x 8 GB DDR5-4800 SODIMM (Expandable to 1x 32 GB) | 1x 32 GB DDR5-4800 SODIMM | |
| Internal Storage / Bays | 2x 3.5" SATA 2x M.2 2280 Gen3 x4 NVMe |
4x 3.5" SATA 2x M.2 2280 Gen3 x4 NVMe |
|
| I/O Ports | 1x USB 3.2 Gen 2 (Type-A) 1x USB 3.2 Gen 2 (Type-C) |
||
| Network Ports | 2x RJ-45 (2x 2.5 GbE) | ||
| Power Adapter | 40W (External) | 90W (External) | |
| Dimensions and Weight | 222mm x 119mm x 154mm / 2.2 kg | 222mm x 179mm x 154mm / 3.4 kg | |
| Price | $380 | $500 | $700 |
The TNAS operating system (TOS) is currently at 5.1, with the release of TOS 6.0 in the near future. Being a comparatively new entrant to the NAS world, the OS and mobile applications lack the polish of the offerings from established vendors, but the good news is that things can only improve from here. The hardware itself is quite capable, and the new 424 series is the first Alder Lake-N-based COTS NAS that we have seen for purchase. Terramaster had earlier experimented with a 10 GbE NAS using Apollo Lake, though it was unable to saturate that interface. The company seems to have opted for a more cost-effective platform with Alder Lake-N in the 424 series.
QNAP remains busy throughout the year, regularly announcing hardware with the latest and greatest from Intel / AMD / ARM-based SoC vendors. The company also takes pride in updating different 'plugins' / first-party applications for their QTS / QuTS Here operating systems to increase their usefulness. Similar to Synology, the focus is slowly shifting more towards business users as a majority of their recent announcements have been related to their ZFS-enabled QuTS Hero-running NAS units.
At the 2023 CES, the company had teased their first consumer-focused hot-swappable all-flash NAS with M.2 / E1.S SSD support. The TBS-h574TX reached retail in late 2023, and QNAP uploaded a comprehensive video detailing the usage and features of the unit last month. After participating in the launch webinar prior to that, my expectations were tempered a bit. In the year since its teaser, the E1.S form-factor has not taken off as expected. Instead, we saw vendors like Solidigm and Micron focus on the traditional 2.5" form-factor with U.2 and U.3 SSDs. E1.L is making more sense for rackmount machines requiring very high storage density, but the general market trend seems to be more towards U.2 / U.3 for both consumer and SMB / SME on-premise usage. 2023 also saw the launch of 64TB-class U.2 / U.3 SSDs, and this form-factor seems widely available for purchase.
We believe that the M.2 form-factor in the NAS is better suited for caching and/or non-hot-swappable storage, while U.2 / U.3 makes more sense for hot-swappable units. QNAP pioneered the all-flash consumer NAS with the TBS-464 and ASUSTOR's Flashstor series made additional options available. The TBS-h574TX brings hot-swap into the picture, but some of the drawbacks of the designs still remain. For example, none of the SSD slots get the full four-lane capability, even though they physically accept x4 SSDs. QNAP contends that this is enough to saturate the 10GbE link, but that seems like a trade-off best avoided when it is possible to use the network port along with Thunderbolt (acting in IP mode with only 10 Gb capability per port) to have a 30 GbE up / 30 GbE down configuration. Single-slot occupancy can't deliver full performance in that configuration. In any case, QNAP believes their video production house customers will still find this unit delivering better performance than other options currently available in this form-factor, and they may be right on the practical front.
At $1200, this Raptor Lake-based system is not particularly cheap. Despite using an embedded part (Core i3-1340PE) which comes with in-band ECC support from Intel, QNAP doesn't have that enabled in the system (hopefully it is something that can be addressed in a future update). Overall, this product seems like a missed opportunity for QNAP in the all-flash consumer NAS market.
Moving on to the latest hardware introductions, QNAP is focusing more on ZFS-enabled NAS units now. The company recently introduced two rackmount units based on the Ryzen 7000 series, and their specifications are summarized in the table below.
| QNAP TS-h77AXU-RP Series (Ryzen 7000 Series) | ||||
| Model | TS-h1277AXU-RP-R5-16G | TS-h1277AXU-RP-R7-32G | TS-h1677AXU-RP-R7-32G | |
| Platform | AMD Ryzen 5 7600 (6C/12T Zen 4 @ up to 5.1 GHz / AMD Radeon Graphics) |
AMD Ryzen 7 7700 (8C/16T Zen 4 @ up to 5.3 GHz / AMD Radeon Graphics) |
||
| RAM (ECC UDIMMs Supported) | 1x 16 GB DDR5-5200 UDIMM (Expandable to 4x 32 GB) | 1x 32 GB DDR5-5200 UDIMM (Expandable to 4x 32 GB) | ||
| Internal Storage / Bays | 12x 3.5" SATA 2x M.2 2280 Gen5 x2 NVMe |
16x 3.5" SATA 2x M.2 2280 Gen5 x2 NVMe |
||
| I/O Ports | 2x USB 3.2 Gen 2 (Type-A) | |||
| Network Ports | 4x RJ-45 ([2x 2.5 GbE] + [2x 10GBASE-T]) | |||
| PCIe Expansion Slots | (Slot 1 + Slot 2): (Gen4 x4 + Gen4 x4) or (N/A + Gen4 x8) Slot 3: Gen4 x4 |
|||
| Power Supply | 550W x2 | |||
| Dimensions and Weight | (2U) 88.65mm x 432.05mm x 511.3mm / 13 kg | (3U) 131.32mm x 482.09mm x 550.93mm / 15.64 kg | ||
| Price | $3299 | $3999 | $4699 | |
All models utilize 5GB of flash storage with dual-boot OS protection. ZFS support brings in deduplication and other features important for enterprise deployments. These are some of the first NAS units to support Gen5 M.2 SSDs (albeit, with x2 links), and QNAP advises use of their own heat-sink on them for use in these rackmounts. The redundant power supply configuration is also important in the use-case scenarios for these units, and the available expansion slots allows end users / IT administrators to add 25GbE network cards or SAS / SATA storage expansion cards as required. GPU pass-through is also supported, which can help specific virtualization setups where the VM and associated storage setup run on the same server block.
In software news from QNAP, the company is also promoting its machine-learning based drive failure prediction tool that uses a cloud-based engine beyond the traditional SMART readouts. It uses a third-party engine and requires a license purchase for use on more than one disk per NAS. QNAP is also touting its SSD anti-wear leveling features (QSAL) as a differentiating aspect of its QuTS ZFS operating system. These types of value-additions may help QuTS go head-to-head against options like TrueNAS.
Historically, delidded CPUs have been the prerogative of die-hard enthusiasts who customized their rigs to the last bit. But with emergence of specially-designed delidding tools, removing the integrated heat spreader from a CPU has become a whole lot easier, opening the door to delidding for a wider user base. To that end, EK is now offering all-in-one liquid cooling systems tailored specifically for delidded Intel LGA1700 processors.
The key difference with EKWB's new EK-Nucleus AIO CR360 Direct Die D-RGB – 1700 cooler is in the cooling plate on the combined base pump block. While the rest of the cooler is essentially lifted from the company's premium 360-mm closed-loop all-in-one liquid cooling systems, the pump block has been equipped with a unique cooling plate specifically developed for mating with (and cooling) of delidded Intel's LGA1700 CPUs.
Meanwhile, since delidded CPUs lose the additional structural integrity provided by the IHS, EK is also bundling a contact frame with the cooler that is intended to protect CPUs against warping or bending by maintaining even pressure on the CPU. A protective foam piece is also provided to prevent liquid metal from spilling over onto electrical components surrounding the CPU die.
According to the company, critical components of the new AIO, such as its backplate and die-guard frame, were collaboratively developed by EK and Roman 'Der8auer' Hartung, a renowned German overclocker who has developed multiple tools both for extreme overclockers and enthusiasts. In addition, EK bundles Thermal Grizzly's Conductonaut liquid metal thermal paste (also co-designed with Der8auer) with the cooling system.
And since this is a high-end, high-priced cooler, EKWB has also paid some attention to aesthetics. The cooler comes with two distinct pump block covers: a standard cover features a brushed aluminum skull, surrounded by a circle of LED lighting that creates a classic yet bold aesthetic, and an alternate, more minimalist cover without the skull.
Traditionally, cooling for delidded CPUs has been primarily handled by custom loop liquid cooling systems. So the EK-Nucleus AIO CR360 Direct Die D-RGB – 1700 stands out in that regard, offering a self-contained and easier-to-install option for delidded CPUs. Especially as delidding has been shown to reduce temperature of Intel's Core i9-14900K CPU by up to 12ºC, it's no coincidence that EKWB is working to make delidding a more interesting and accessible option, particularly right as high-end desktop CPU TDPs are spiking.
Wrapping things up, EKWB has priced the direct die cooler at $170, about $20 more than the EK-Nucleus AIO CR360 Lux D-RGB cooler designed for stock Intel processors. The company is taking pre-orders now, and the finished coolers are expected to start shipping in mid-March 2024.
Micron's consumer brand, Crucial Memory, has been putting extra focus on the SSD market over the last few quarters. The brand was marketing entry-level QLC drives in the 2018 - 2022 time frame. Recently, emphasis has also been placed on cutting-edge SSDs - both internal (such as the Gen4 T500 and Gen5 T700) and external (such as the X10 Pro). Vertical integration, coupled with Micron being the first flash manufacturer to achieve volume production of 200+ layer 3D NAND, has been crucial to Crucial's success in these segments.
At the 2024 CES, Micron had a couple of interesting USB4 SSD technology demonstrations for its resellers / partners and invited media. These are essentially products under development (with no guarantees that they would make it to the market in their current form). Both products are bridge-based solutions using the ASMedia ASM2464PD USB4 to NVMe accessory controller. The key update over the popular ASM2364 (USB 3.2 Gen 2x2 upstream, and PCIe 3.0 x4 downstream) is the shift to a 40 Gbps USB4 upstream port along with a PCIe 4.0 x4 link downstream. The power delivery component of the Type-C specification is also implemented within the controller.
The portable SSD version has a gumstick form-factor, with the transparent casing housing a M.2 2280 SSD - a 2TB Gen4 Micron 3400 OEM drive in this case.
The drive is expected to be passively cooled, with the larger form-factor enabling a thermal performance similar to that of the X10 Pro / X9 Pro. Bridge-based solutions are the standard option for high-performance portable SSDs.
Similar configurations (bridge + DRAM-equipped M.2 SSD) such as the SanDisk Extreme PRO v2 (E81) have yielded excellent all-round performance for a wide range of workload types. We expect the same to continue in the USB4 era. That said, vendors like ADATA using the same bridge have opted for active cooling to avoid thermal throttling in their USB4 PSSD. It remains to be seen if this design will remain fanless in its final form (and if it does, thermal performance would be an interesting aspect to analyze).
The USB4 desktop SSD is a comparatively unique product. This is an actively cooled design with a small fan, and uses a U.3 SSD inside. Other vendors like OWC have tried multiple M.2 SSDs configured with software RAID in a large-sized enclosure, but this one has a single high-capacity drive (8TB in the sample being demonstrated).
Designed for stacking (without daisy-chaining support), the eSSD also requires external power. The drive can also power notebooks through the USB4 connection, which can make up for the presence of a discrete power adapter. Specifics of the power delivery will only be available when the product is officially introduced. This product could be made more attractive by having some downstream USB Type-A / Type-C ports (eSSD in a dock). That said, there are two aspects that will probably make this the performance and consistency king of USB4 SSDs - the presence of a fan, and the use of a Gen4 U.3 SSD (which is most likely an enterprise drive that advertises worst-case performance and not speeds in the SLC cache region).
The current crop of USB4 SSDs are focused on performance, and sacrifice power- and energy-efficiency. Those aspects will be addressed by native USB4 UFD controllers like Phison's U21. Silicon Motion tends to keep controllers under wraps until reference designs are ready to ship (if the introduction of the SM2320 was anything to go by). We expect external / portable SSD vendors to eventually add native UFD controller-based products to their USB4 lineup, but that seems unlikely to happen in the first half of 2024.
Further to Intel's AI-related announcements surrounding their Meteor Lake SoC and its integrated NPU, the automotive market is another market where Intel expects that AI can make a big difference. Intel has just expanded its attention to the automotive AI market by acquiring Silicon Mobility SAS, a company specializing in EV energy management and AI-enhanced software driving the digital cockpit. This specific acquisition is set to enhance Intel's capabilities in delivering efficient energy management solutions for EVs and the AI-driven ecosystem.
During CES 2024, Intel has unveiled a new AI-enhanced software-defined vehicle (SDV) SoC family. These chips leverage Intel's expertise in AI and show ambitions to bring advanced in-vehicle AI applications such as Generative AI and camera-based driver/passenger monitoring. Zeekr, a brand of Geely, has been announced as the first OEM to adopt these new Intel SoCs for automotive.
Not only is Intel looking to play a more pivotal role in the automotive industry through its expertise in AI, including hardware, software, and everything in between, but it also looks to help enhance the overall AI-driven ecosystem within the EV market. In addition, Intel has announced it is chairing a new SAE automotive vehicle power management standards workgroup, which aims to develop and define the industry standards for EV power management, including J3311.
One of the challenges within the automotive cockpit is power management and efficiency, which is a much more significant obstacle than it is in, say, the general PC. The SoC is an integral part of powering digital cockpits and entertainment systems, as well as safety measures such as LiDAR, radar, and camera sensors in real-time; this is something AI, through analytics in real-time, can play a crucial role in being the difference between safety and disaster.
The first generation of Intel's new SDV SoC family, first announced during the CES 2024 Intel Automotive Keynote, shares some key details. This includes a scalable SoC of up to 12 cores, with power capabilities ranging from 12 to 45 W, depending on the cockpit level and EV power requirements. They also feature integrated Arc Xe integrated graphics, with support for up to four Indept displays capable of up to 8K resolutions. The automotive industry has highly stringent safety standards, so the new Intel SDV SoC family is AEC-Q100 qualified.
We expect to hear more details about Intel's SDV SoC family in the coming months, with no disclosures on the finer technical details of the SoC or how it will transition Intel into the EV cockpit. Overall, Intel is clearly looking to make a dent in the largely progressive and high-growth AI-driven EV market.
Phison's lineup of SSD and portable SSD controllers is keeping pace with the general industry trends, as evidenced by their products on display at the 2024 CES.
Portable SSDs in all forms and sizes (including the popular thumb drive as a SSD-in-a-stick) have gained a lot of market and mind-share in recent years, thanks to rising capacity and performance. An important contributor on the power-efficiency front (which is important for flash drive vendors to pack SSD performance in a thumb drive) has been the rise of native flash controllers like Phison's U17 / U18 and Silicon Motion's SM2320.
Since the launch of the U17 / U18 in 2021, USB4 has become common on client platforms from both Intel and AMD. SSD controller vendors are keeping pace with that update, and Phison is officially the first out of the door with their U21 USB4 eSSD controller. (Note: It appears that the PSSD nomenclature promoted by SSD vendors is being replaced by eSSD on the controller side). Similar to the U17 / U18, these are single-chip solutions. Small thumb drives may also end up using these in a multi-chip package (where the flash and the controller are packaged together to save on area).
Phison indicated that the U21 controller can practically saturate the USB4 bus with speeds up to 4000 MBps. Fabricated in TSMC's 12nm process, the U21 can support up to four channels with 16 chip enables. Backwards compatibility is an important aspect. USB4 requires compatibility with only USB 3.2 Gen 2, USB 3.2 Gen 1, and USB 2.0 for certification purposes. However, the U21 can also work in the USB 3.2 Gen 2x2 (20 Gbps) mode if required. Phison's customers can use this controller for PSSDs ranging in capacity from 512GB to 8TB. Both TLC and QLC NAND can be used. Flash speeds of up to 1600 MT/s is supported. This might hold back the power- and energy- efficiency a bit, as we have seen higher flash speeds getting the job done faster and having lower overall energy consumption for a given workload. Higher flash speeds also reduce the number of required channels for a given performance target, and that results in power savings too. It remains to be seen if other eSSD controller vendors support 2400 MT/s flash later this year.
In internal SSD controller news, Phison is also readying the E31T mainstream Gen 5 controller for launch this year. As the naming convention goes, this is a DRAM-less controller suitable for mainstream M.2 2280 SSDs with a focus on low power operation (suitable for mobile platforms). This quad-channel controller is fabricated in TSMC's 7nm process with peak performance numbers of around 10800 MBps for sequential workloads and 1.5M IOPS for 4K random accesses.
Support for TCG Opal / Pyrite ensures that the E31T platform can also be used for OEM SSDs meant for business deployments.
Phison also had the X2 enterprise SSD platform on display. This is a Gen 5 x4 dual port U.2 solution (also available in E3.S form factor) with steady state sequential performance of 14 GBps for reads and 12 GBps for writes. Random read IOPS are at 3M, and write IOPS are at 0.8M.
Phison's X1 platform was adopted by Seagate in the Nytro 5050 Series, and it is likely that we will see the X2 come to market with a different performance profile / firmware tuning when the Nytro series get an update.
After Samsung's earlier product page snafu, the company is officially launching their next-generation mainstream client SSD today. The 990 EVO will be available in both 1TB and 2TB capacities, and offers an interesting mix of both PCIe Gen 5 and PCIe Gen 4 support by allowing up to 2 lanes of PCIe connectivity at Gen 5 speeds, or up to 4 lanes at Gen 4 and below.
The release of the 990 EVO marks the return of the EVO SSD brand after it was quietly put aside during the 980 generation, when Samsung's sole non-PRO drive was the vanilla 980 SSD. Consequently, Samsung's own performance comparisons for the new drive are against the most recent EVO, the 970 EVO Plus, though similar to how the vanilla 980 was effectively the 970 EVO successor, in many ways this is the successor to the 980.
The drives are available immediately from Samsung. The company has set the retail prices of the drives at $125 for the 1TB model, and $210 for the 2TB. These are stiff prices for a drive debuting in the highly-competitive mainstream SSD market, though admittedly not unusual for a Samsung drive launch.
Our original story (with updated technical specifications) follows as below:
Originally Published: 01/09/2024
Samsung's launch of the 990 EVO M.2 2280 SSD appears to be imminent, as official product pages with specifications went live in certain regions a few days back before getting pulled down.
The most interesting aspect the 990 EVO is not the claimed speeds, but the fact that it can operate in either Gen 4 or Gen 5 modes with different number of lanes. The recently launched mobile platforms from both AMD and Intel use Gen 4 lanes for the storage subsystem. However, with progress in technology it is inevitable that this will move to Gen 5 in the future. In the meanwhile, thermal constraints in mobile systems may prevent notebook manufacturers from going in for desktop Gen 5 speeds (8 - 14 GBps). An attractive option for such cases would be to move to a two-lane Gen 5 implementation that would help in retaining the same Gen 4 x4 bandwidth capability, but cut down on the BOM cost by reducing the number of pins / lane count on the host side. It appears that Samsung's 990 EVO is a platform designed with such a scenario in mind.
PCIe PHYs / controllers have backward compatibility, and the 990 EVO's SSD controller incorporates a 4-lane Gen 5 controller and PHY. During the training phase with the host, both the link bandwidth and lane count can be negotiated. It appears that the SSD is configured to advertise Gen 5 speeds to the host if only two lanes are active.
Samsung appears to be marketing only 1TB and 2TB capacities of the 990 EVO. Based on the product photos online, the models appear to be single-sided units (making them compatible with a wider variety of mobile platforms). The flash packages appear to be 1TB each, and the EVO moniker / advertisement of Host Memory Buffer support / controller package markings in the product photos points to a DRAM-less SSD controller - the Piccolo S4LY022. The quoted performance numbers appear low for a 176L / 236L V-NAND product. TechPowerUp believes that these SSDs are using an updated V6 (133L, termed V6 Prime) with better efficiency and yields compared to the regular V6.
| Samsung 990 EVO Specifications | ||||
| Capacity | 1 TB | 2 TB | ||
| Controller | Samsung S4LY022 Piccolo | |||
| NAND Flash | Samsung Updated 6th Gen. V-NAND (133L 3D TLC) | |||
| Form-Factor, Interface | Single-Sided M.2-2280, PCIe 4.0 x4 / 5.0 x2, NVMe 2.0 | |||
| Sequential Read | 5000 MB/s | 5000 MB/s | ||
| Sequential Write | 4200 MB/s | 4200 MB/s | ||
| Random Read IOPS | 680K | 700K | ||
| Random Write IOPS | 800K | 800K | ||
| SLC Caching | Yes | |||
| TCG Opal Encryption | Yes | |||
| Warranty | 5 years | |||
| Write Endurance | 600 TBW 0.3 DWPD |
1200 TBW 0.3 DWPD |
||
Samsung is also touting much-improved power efficiency, with transfer rates being 2 - 3x per Watt compared to the 970 EVO. The Piccolo controller's 5nm fabrication process and the V6 Prime's efficiency improvements have a significant say in that aspect.
Pricing and concrete launch dates for the 990 EVO are not available yet. The delta in specifications for the 1TB and 2TB models will be updated in the table above once the drives are officially announced. The 1TB model is priced at $125 and the 2TB version at $210. Both SKUs are available for purchase today.
Ahead of next week’s CES 2024 trade show, this morning VESA is releasing an update to their Adaptive-Sync Display variable refresh certification standard to accommodate some forthcoming “dual-mode” gaming displays. Under the new Adaptive-Sync Display 1.1a standard, display manufacturers will now be able to certify displays that have multiple resolution-dependent maximum refresh rates – chiefly, those displays offering high refresh rates at high-DPI resolutions such as 4K, and even higher refresh rates at 1080p and the like. The 1.1a version of the standard is also being updated to support displays with overclocked modes, allowing display manufacturers to get those modes separately certified on top of their default modes.
Displays offering higher maximum refresh rates at lower resolutions are not strictly a new innovation in the space, but PC enthusiasts are likely to be more familiar with the concept with 4K TVs. Constrained by the available cable bandwidth of the time, HDMI 2.0-era sets such as LG’s C8 OLEDs could offer either 60Hz support at 4K, or 120Hz support at 1080p. And while the concept has fallen by the wayside a bit since the arrival of HDMI 2.1, it has not gone away entirely. Now, as we go into 2024, VESA and its display manufacturing members are preparing to launch a new generation of PC gaming displays that employ the dual-mode concept to allow for even higher refresh rates at lower resolutions.
To that end, the Adaptive-Sync Display standard is being updated to include certification testing criteria and branding to explicitly support and promote these dual-mode displays. According to VESA, the testing criteria itself hasn’t changed – in fact, for existing 1.1-certified monitors, everything is identical – but rather the specification is laying out how manufacturers can get both modes certified. In other words, manufacturers will be able to get their wares validated as meeting the Adaptive-Sync Display standard’s variable refresh performance requirements in both high-resolution and high-refresh modes.
To go with this new certification program, the Adaptive-Sync Display logo program has also been updated to reflect these results. Certified dual-mode displays will list both modes they’re certified for, with the logo to include the refresh rate and the resolution.
Top: Classic/Single-Mode Logo. Bottom: New Dual-Mode Logo
In VESA’s example, their fictitious product is a 4K display that offers a 144Hz maximum refresh rate at 4K, and 280Hz at 1080p. For vendors that do choose to seek dual-mode certification, VESA is requiring that the high-resolution mode support a maximum refresh rate of at least 144Hz, while the high-refresh mode’s resolution not be any lower than 1080. The net result is that the new dual-mode specification is primarily geared towards 4K monitors since it’s a multiple of 1080p, but it’s not exclusively baked into the spec. Otherwise, displays will need to support all of the feature requirements of Adaptive-Sync Display, including flicker-free operation and fast G2G transition times.
Meanwhile, reading between the lines on VESA’s press release ahead of CES, it would appear that the addition of dual-mode certification to the Adaptive-Sync Display standard – and indeed the creation of the displays themselves – is being driven by the same bottleneck that lead to dual-mode TVs in the last decade: display cable and processor bandwidth limitations. While DisplayPort 2.1 is already the fastest display cable standard around, with UHBR 20 mode offering almost 80Gbps of bandwidth, few source devices offer that much bandwidth. AMD restricts UHBR 20 mode support to its Radeon Pro cards, and NVIDIA’s current-generation Ada Lovelace (RTX 40 series) hardware doesn’t support DisplayPort 2.x at all. So while forthcoming 4K displays can refresh at upwards of 480Hz, the bandwidth to do so at 4K isn’t consistently there.
The end result is that, depending on whether you’re a glass half-full or half-empty kind of person, high-end gaming displays are either being given the opportunity to increase their refresh rates at low resolutions, or they’re having to cap their refresh rates at high resolutions. Either way, without the bandwidth necessary to drive 4K at 480Hz and similarly high resolutions, display vendors are needing to separate maximum refresh rates by resolution to accommodate what contemporary hardware can actually provide.
ASUS's Forthcoming ROG Swift PG32UCDP
Meanwhile, although the VESA consortium itself doesn’t announce any products, but both LG and ASUS have been teasing dual-mode gaming displays in the last couple of months, which in turn we’re expecting to see in greater detail at CES. LG has the forthcoming LG 32GS95UE, which is pictured at the top of this article and offers a 32-inch 4K WOLED display with maximum refresh rates of 4K@240Hz and 1080p@480Hz. ASUS, in turn, will be using that panel for their ROG Swift PG32UCDP, offering the same 4K@240Hz and 1080p@480Hz modes. We’ll likely see more displays from more manufacturers in due time, but given the popularity of their OLED displays, LG alone is enough to move the gaming market.
Moving on, the Adaptive-Sync Display 1.1a specification is also adding support for what the group classifies as “overclocked” displays – that is, monitors offering a faster mode that is not enabled by default in the out-of-the-box factory configuration. Under the updated spec, OEMs who offer monitors with overclocking modes will be allowed to pursue a higher Adaptive-Sync Display certification level (i.e. a higher logo’d refresh rate), so long as they can pass the standard’s requirements in both factory and overclocked modes. Notably, the VESA is also requiring that overclocked displays “must support Adaptive-Sync-enabled GPUs in a non-proprietary manner”, which seems intended to shortcut any G-Sync-exclusive shenanigans.
At this time we aren’t immediately aware of any forthcoming monitors that would rely on the new overlcocking rules. But given the market-driven nature of VESA’s standards, we’d assume such displays are right around the corner, just like dual-mode gaming displays.
Regardless, expect to hear more from the CES show floor next week as manufacturers begin talking about their next generation of gaming displays.
LaCie's portable storage drives have enjoyed a fan following, particularly among creative professionals valuing both performance and product design / appearance. After Seagate's acquisition, the brand has continued to cater to this segment with new products. The company has both USB 3.2 Gen 2 and Thunderbolt 3 SSDs under the LaCie brand, and is adding a new 2 GBps-class Rugged Mini SSD today.
The USB 3.2 Gen 2x2 (20 Gbps) ecosystem has been gaining traction recently after the launch of a number of low-cost portable SSDs based on native controllers. The new LaCie Rugged Mini SSD belongs to the same category, albeit with a slight premium for the product design. The PSSD is available in four capacities - 500GB, 1TB, 2TB, and 4TB. The company sampled the 2TB version to put through our direct-attached storage test suite.
Read on for a comprehensive look at the performance profile and value proposition of the LaCie Rugged Mini SSD, with a particular focus on how Seagate differentiates the product from others using the same NAND / UFD controller combination.
Seagate's IronWolf Pro lineup of hard drives for network-attached storage units has consistently offered good value for money, particularly at the highest capacity points. I purchased two 22TB IronWolf Pro drives for production deployment late last year. As part of the burn-in testing prior to actual deployment, they were put through our evaluation routine for direct-attached storage drives in both internal and external (Thunderbolt 3 DAS) modes. Read on for a look at the performance you can expect from the drive in standalone, RAID 0, and RAID 1 modes.
When it comes to all-in-one liquid coolers for CPUs, there are a handful of companies whose brands have become synonymous with the titanic coolers. And of those brands, it's Corsair who is inevitably at the top of any list. One of the key manufacturers responsible for popularizing AIO coolers with the enthusiast PC community, the company has built a very successful and well-renowned business segment out of providing maintenance-free AIO cooler designs – a history that at this point spans over 20 years.
With such a long history, we've seen Corsair update their cooler designs several times now, continually iterating on their designs to improve performance, increase reliability, or even just add RGB lighting to match modern styles. Most recently, Corsair introduced their iCUE LINK family of coolers, which incorporate the titular iCUE LINK system that allows for multiple Corsair peripherals to be connected together and controlled via a central hub. Besides simplifying the process of using multiple Corsair devices together, the iCUE LINK system is also designed to cut down on cable clutter by reducing the overall number of cables down to just one: the iCUE LINK cable going to the next-nearest Corsair device.
To that end, today we're taking a look at the latest generation of Corsair's popular H150i cooler, the iCUE LINK H150i RGB. Succeeding the well-received Elite Capellix models, the newest iCUE LINK H150i RGB stands out with its integration into the iCUE ecosystem, while building and improving upon the already solid foundation of the basic H150i cooler design. While the H150i is not technically Corsair's flagship cooler – that honor goes to the massive 420mm H170i series – most cases cannot accommodate coolers larger than the 360mm H150i, making it the most visible of Corsair's increasingly colorful coolers.
Low-cost infrared cameras have been flooding the market since FLIR and Seek Thermal opened up the consumer thermal camera market in the late 2010s. The rise of smartphones has enabled these manufacturers to take out a good chunk of the regular thermal camera cost, allowing them to focus on the core sensor and USB bridge alone. The consumer products from vendors like FLIR and Seek Thermal are limited by US laws to a 9 Hz frame rate. However, we have seen a new crop of thermal cameras from Asian vendors that don't seem to be subject to these limitations. Two vendors - InfiRay and TOPDON - reached out with review samples of their consumer-focused smartphone-attachable thermal cameras. Read on for a comparative look at the features of the InfiRay P2 Pro and the TOPDON TC001, with a focus on the user experience aspect.
Over the last year, we've been looking at increasingly intricate 1000W power supplies from prolific PSU maker FSP. These have included their 80Plus Gold-rated Hydro G Pro, as well as their 80Plus Platinum rated Hydro PTM X Pro. Today we're finally capping things off with a look at the crème de la crème of the Hydro series, the 80Plus Titanium rated Hydro Ti Pro.
The flagship of the company's ATX PSU lineup, the Hydro Ti Pro is designed to demonstrate the apex of the company's design capabilities, offering ample power capacity while also achieving excellent energy efficiency and reliability. Which for a 1000W PSU means being able to support multiple GPUs and demanding overclocking conditions, all without wavering elsewhere. FSP's 80Plus Titanium certified unit stands out, in this regard, with its cutting-edge design and features tailored for longevity and consistent performance.
As we explore the details of the FSP Hydro Ti Pro 1000W, we will examine every aspect of this PSU to determine if it meets the high expectations associated with FSP's legacy and satisfies the demands of advanced computing environments. As well, we'll be looking at how it compares to its Gold and Platinum-rated compatriots, to see just what buying a higher efficiency brings to the table, both in direct electrical efficiency and secondary attributes, such as component quality and fan noise.
NAND flash technology has seen rapid advancement in recent years. This has resulted in the capacity limits of SSDs and thumb drives getting pushed up regularly. Companies like Kingston had innovated in the late 2010s to deliver 1TB and 2TB thumb drives. They were overpriced and over-sized for their product class at that time. However, interest in this category has been sparked again by the introduction of high-performance native UFD controllers and the appearance of cost-effective high capacity NAND dies. Silicon Power and Transcend recently released 2TB thumb drives based on the Phison U17 and Silicon Motion SM2320 native UFD controllers respectively. Read on for a comprehensive analysis of the performance profile and value proposition of the Silicon Power MS70 in its 2TB avatar.
Apple on Monday said it would pause sales of its Watch Series 9 and Ultra 2 in the U.S. due to an ongoing patent dispute. The patents in question cover the blood oxygen feature in the watches, and belong to medical technology company Masimo. Apple itself said it would halt sales of its latest oxygen sensor-equipped smart watches online starting December 21, and in retail starting December 25.
The dispute's roots lie in Masimo's claims that Apple's blood oxygen sensor infringes on 15 of its patents. The ITC ruling, announced in October, upheld a judge's decision from January and triggered a 60-day Presidential Review Period, which will be expiring on December 25. Despite the possibility of a veto from President Biden, Apple decided to halt sales of its latest smart watches as a proactive measure.
Sales of the affected Apple Watch models will cease on Apple's website after 3 PM ET on December 21 and in Apple's retail stores after December 24. Notably, this ban is exclusive to Apple’s direct sales channels; third-party retailers like Amazon and Best Buy can continue selling the devices until December 25. This limited scope of the ban provides a brief window for consumers to purchase these models from alternative sources in time for Christmas.
Behind the scenes, Apple is actively contesting the ruling and exploring various legal and technical options to ensure the continued availability of its watches. The company argues that the ban could adversely affect both consumers and the broader economy, given the significant revenue generated by Apple's wearables business, especially during the Q1 2023 holiday quarter. Meanwhile, Masimo maintains its stance, viewing the ITC's ban as a strong message about adhering to patent laws.
The Patent Trial and Appeal Board evaluated 17 Masimo patents, invalidating 15, a decision that Masimo is now contesting. During Masimo's trade secret misappropriation trial in May, a judge dismissed half of its 10 claims due to insufficient evidence. Of the remaining claims, a majority of jurors sided with Apple, but with one dissenting, they could not reach a unanimous verdict, leading to a mistrial. A date for a new trial has yet to be set.
Currently, there is no defined duration for the unavailability of Apple Watch Ultra 2 and Series 9. While a veto from the Biden administration remains possible, Apple plans to appeal the ITC's decision with the U.S. Court of Appeals for the Federal Circuit after the Presidential Review Period, starting December 26. This appeal will not postpone the sales and import ban on these models since the disputed Masimo patents are valid until August 2028, but if the court sides with Apple, the company could return its products to the U.S. market. Apple has alternative options, such as negotiating a settlement or a licensing deal with Masimo. Additionally, the company could redesign its smartwatches to bypass the two Masimo patents, possibly by updating Apple Watch's firmware.
It should be noted that the ITC's decision is specific to models featuring the blood oxygen monitoring technology. As a result, the Apple Watch SE, which lacks this feature, remains unaffected and will continue to be available.
The ban's impact is expected to affect Apple's earnings, yet it does not affect Apple Watches already sold or their functionality. Existing models with the blood oxygen sensor, introduced with the Apple Watch Series 6 in 2020, will continue to operate as usual. Furthermore, the ITC's order permits service, repair, or warranty work on units sold before December 25.
An increasingly common face in the power supply market, the bulk of XPG's work thus far has been on high-end, high-margin power supplies, such as their 80Plus Platinum-rated Cybercore II. But as the company has become better established in the PSU market on the back of multiple successful products, the company is looking to expand their footprint by venturing into the mid-range segment.
Spearheading that effort is the new XPG Core Reactor II series. Looking to maintain their competitive edge with, what's frankly, a cheaper power supply design, XPG needs to walk a very tight rope, where where the equilibrium between performance, quality, and cost is crucial. In this category, PSUs must support a range of computing setups while maintaining a focus on value for money. The Core Reactor II series represents XPG's dedication to this segment, illustrating their capability to cater to a broad spectrum of users who seek a blend of reliable performance and economic viability.
As an 80Plus Gold certified unit and without too many bells and whistles, the Core Reactor II stands out for its practical design, tailored to deliver consistent performance without the premium cost. In examining the details of the XPG Core Reactor II series, we will evaluate how well these PSUs align with XPG’s commitment to affordable quality and whether they meet the diverse needs of mid-range computing environments.
When the USB4 specification emerged several years ago, it was quickly positioned as a less expensive alternative to the Thunderbolt 3 technology which ruled the market of high-performance direct-attached storage (DAS) devices and docking stations. Since then, we've seen multiple USB4 docks hit the market, but USB4 DASes and SSDs are still rare. Thankfully, the situation began to change in the recent weeks, as multiple vendors have finally begun releasing their own USB4 SSDs and external drive enclosures.
Adata announced its first SE920 External USB4 SSD back in August 2021, but it only started shipping these drives in October. Adata's SE920 External SSDs offer capacities of 1 TB or 2 TB, along with a sequential read speed rating of up to 3.8 GB/s as well as a sequential write speed of up to 3.7 GB/s when working with a USB4 host. Otherwise, the drive is rated for 3.20 GB/s on Thunderbolt hosts, due to the greater overhead of the Thunderbolt protocol.
One interesting feature of the Adata SE920 External USB4 SSD is that it comes with a 'telescoping' case that allows to activate its internal fan for better heat dissipation. Such design allows to better ensure consistent performance under high loads, which is set to be particularly useful when transferring large volumes of data. Meanwhile, like other modern SSDs, the SE920 uses pseudo-SLC caching, which means that it demonstrates its maximum performance only while there is spare SLC-cache.
Adata's drive looks like a very decent product overall, and it's priced very competitively with other high-performance drives on the market, with Adata charging around $150 for the 1 TB version and $200 for the 2 TB version.
Meanwhile, for the DIY crowd that wants to build their own USB4 SSDs, standalone USB4 enclosures are finally available as well. OWC's Express 1M2 enclosure is based on the ASMedia ASM2464PD USB4/Thunderbolt to NVMe bridge, and is compatible with virtually any NVMe M.2-2280 SSD.
The enclosure supports sequential read/write speeds of up to 3,151 MB/s, as well as capacities up to 8 TB (the largest M.2 2280 drive capacity currently available). Mindful of how warm modern, high-end SSDs can get, the enclosure's case acts like a huge heat sink, helping to keep those increasingly toasty SSDs cool.
On paper, OWC's Express 1M2 DIY enclosure does not reach speeds quite as high as Adata's SE920 SSD, so the extra capacity and ability to throw in any M.2 SSD you have lying around are the main selling points of the device. Pricing, on the other hand is a higher hurdle; OWC is charging $119.99 for the Express 1M2 enclosure on its own, and $219.99 for the enclosure with pre-installed 1 TB SSD.
Although OWC's DIY USB4 SSD enclosure seems a bit overpriced, good news is that the company is not alone selling such devices. Stardom also has its UBOX-B4BP USB4 SSD enclosure that has the same feature set (e.g., compatibility with almost any M.2-2280 SSD and latest PCs), but it is slightly larger and its rated performance figures are up to 2,920 MB/s for writes and up to 3,214 MB/s for reads.
The enclosure allows building external USB4 storage solutions of up to 8 TB (and larger when such drives become available) that can work with both new and old PCs. Interestingly, Stardom has included a second USB-C connector on the enclosure solely for power purposes, allowing it to be used with an external power adapter if a host can't provide enough bus power on its own.
Stardom yet has to start selling its its UBOX-B4BP USB4 SSD enclosure in the U.S. and Europe, but in Taiwan the product costs NT$3,990 ($120 without VAT), which is not exactly cheap.
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